Backside power delivery
OwnerBelgacem Haba, Rasit Onur Topalogluinventors
Life of this patent
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Abstract
Embodiments herein provide for stacked semiconductor devices and related manufacturing methods. A stacked semiconductor device comprises a first semiconductor device and a second semiconductor device. The second semiconductor device comprises one or more circuits to deliver power to one or more components in a front portion of the first semiconductor device. The second semiconductor device or an apparatus including the second semiconductor device is directly bonded to a backside of the first semiconductor device.
Claims22
1-20. (canceled)
A stacked semiconductor device comprising:
- a first semiconductor device;
- and
- an apparatus comprising a plurality of second semiconductor devices, wherein at least one of the second semiconductor devices of the plurality of the second semiconductor devices comprises one or more circuits to deliver power, and wherein the apparatus is directly bonded to a backside of the first semiconductor device and an edge of each second semiconductor device faces a backside of the first semiconductor device.
A stacked semiconductor device comprising:
- a first semiconductor device comprising one or more first power regulators in a front portion of the first semiconductor device;
- and
- an apparatus comprising a plurality of second semiconductor devices, wherein at least one of the second semiconductor devices of the plurality of the second semiconductor devices comprises one or more second power regulators, and wherein the apparatus is directly bonded to a backside of the first semiconductor device and an edge of each second semiconductor device faces a backside of the first semiconductor device, wherein the one or more first power regulators and the one or more second power regulators drive one or more components in the front portion of the first semiconductor device.
41-45. (canceled)
Dependencies are inferred from the claim text.