Semiconductor structure and method for fabricating same

A method for fabricating a semiconductor structure, comprising:

• providing a substrate having a power supply port;
• providing a memory module, the memory module comprising a plurality of memory chips stacked in a first direction, each of the plurality of memory chips having a power supply signal line, at least one of the plurality of memory chips having a power supply wiring layer, the power supply signal line being electrically connected to the power supply wiring layer, the power supply wiring layer being positioned in the memory module, an end surface of the power supply wiring layer far away from the substrate being exposed by the memory module, a solder bump being further provided on the end surface;
• fixing the memory module to the substrate, the first direction being parallel to the upper surface of the substrate;
• providing a lead frame, and electrically connecting the lead frame to the solder bump and the power supply port, wherein the lead frame comprises a plurality of frame strips arranged at intervals, and the plurality of frame strips being arranged in a second direction, the second direction is perpendicular to the first direction and is parallel to the upper surface of the substrate;
• wherein each of the power supply wiring layers comprises a plurality of power supply wirings, and different power supply wirings having different voltages;
• and
• wherein different frame strips are connected to the power supply wirings having the different voltages.