Stack of IC chips in lieu of single IC chip

For use in a host computer system which provides multiple separate address signals and multiple separate data signals, a stand-alone memory package adapted to be used in lieu of and in substantially the same space as a single memory chip, comprising:

• a plurality of stacked, glued together IC memory chips;
• circuitry in the package which receives incoming address signals from the host system, buffers each of the address signals, and selects the appropriate address on one of the memory chips;
• and
• circuitry in the package which receives both incoming and outgoing data signals, buffers each of the separate data signals in both directions, and interconnects the separate data signals between the host system and the stacked memory chips in both directions
• said circuitry including means for causing the stacked IC chips to mimic, in the host computer system, the electronic characteristics of a single memory chip.

For use in a host computer system, a stand-alone memory module included in the host computer system in lieu of a single IC memory chip, said module comprising:

• a plurality of separate memory traits, each capable of functioning as a complete memory unit, and each incorporated in a single IC memory chip;
• the IC chips which incorporate the plurality of separate memory units being secured in planar engagement with one another to form an integrated stack in which all the chips share a footprint area;
• said stack further including an IC interface chip having integrated circuitry which provides transmission and conversion of electronic signals between the host computer system and all of the IC chip memory units in the stack;
• the integrated circuitry in the interface chip including circuitry which causes the host computer system to see the plurality of IC chip memory units as though they constituted a single memory unit.