Dummy pattern structure for reducing dishing

A semiconductor package comprising:

• a first die;
• a second die stacked on the first die;
• and
• a hybrid bonding member arranged between the first die and the second die, the hybrid bonding member comprising a dielectric material, bonding pads and a dummy structure;
• wherein the bonding pads are configured to provide electrical connections between the first and second dies and are surrounded by the dielectric material in the hybrid bonding member;
• wherein the dummy structure is configured in one or more spaces where a bonding pad is not present in the hybrid bonding member, the dummy structure not providing an electrical connection between the first and second dies;
• wherein the hybrid bonding member comprises a first area having a first pattern density defined by a first subset of the bonding pads therein and a second area having fewer bonding pads from a second subset of the bonding pads than the first subset, the dummy structure being located in the second area and having a shape selected from the group consisting of an L-shape, an inverse L-shape, and an I-shape configured to occupy the one or more spaces to increase pattern density uniformity within the second area relative to the first area.

A method for fabricating a semiconductor package, comprising:

• arranging bonding pads in a first portion of a bonding member on a first die, the bonding member comprising the first area and a second area;
• arranging bonding pads in a second portion of the bonding member on a second die;
• arranging a first portion of a dummy structure in the first portion of the bonding member;
• arranging a second portion of the dummy structure in the second portion of the bonding member;
• and
• bonding the first die and second die at the first portion and the second portion of the bonding member;
• wherein the first area is configured with a first set of bonding pads configured to provide electrical connections between the first and second dies;
• wherein the second area is configured with a second set of bonding pads configured to provide electrical connections between the first and second die, a quantity of bonding pads in the first set being larger than a quantity of bonding pads in the second set;
• wherein the dummy structure is arranged in one or more spaces in the second area where a bonding pad is not present in the second area, the dummy structure not providing an electrical connection between the first and second die;
• wherein the dummy structure has a shape selected from the group consisting of an L-shape, an inverse L-shape, and an I-shape configured to occupy the one or more spaces to increase pattern density uniformity within the second area.