Semiconductor structure and semiconductor device

A semiconductor device, comprising:

• a substrate;
• a logic chip disposed on the substrate and comprising first wireless communication parts;
• and
• a plurality of layers of memory modules stacked on an upper surface of the logic chip in a first direction, the first direction being perpendicular to the upper surface of the logic chip;
• each memory module comprising a plurality of memory chips stacked in a second direction, the second direction being parallel to the upper surface of the logic chip;
• each memory chip in a top layer comprising one second wireless communication part;
• each memory chip in a non-top layer comprising two second wireless communication parts arranged in the first direction and a wired communication part connected between the two second wireless communication parts,
• wherein two adjacent second wireless communication parts located on different memory chips in the first direction communicate with each other wirelessly;
• and each first wireless communication part communicates wirelessly with a second wireless communication part, which is closest to the first wireless communication part, in a bottom memory chip;
• wherein each memory chip in the non-top layer comprises a solder pad and a solder bump, and each memory chip in the top layer comprises a solder bump;
• the solder pad is located on a top surface of the memory chip, and the solder bump is located on a bottom surface of the memory chip;
• for two adjacent memory chips in the first direction, a solder bump of a memory chip of the two adjacent memory chips which is located above is soldered with a solder pad of a memory chip of the two adjacent memory chips which is located below;
• and solder bumps of memory chips in a bottom layer are soldered with the logic chip.