Electronic device and manufacturing method of electronic device

A manufacturing method of an electronic device, comprising:

• providing a substrate;
• forming a conductive layer on the substrate;
• forming a circuit structure on the conductive layer;
• and
• patterning the circuit structure to form at least one opening,
• wherein the at least one opening has a stepped profile;
• wherein forming the circuit structure on the conductive layer comprises:
• forming a dielectric layer on the conductive layer, wherein the conductive layer is located between the dielectric layer and the substrate;
• patterning the dielectric layer to form a first sub-opening;
• forming an active component layer on the dielectric layer, wherein the dielectric layer is located between the active component layer and the conductive layer;
• and
• patterning the active component layer and a portion of the dielectric layer to form a second sub-opening,
• wherein the second sub-opening corresponds to the first sub-opening in a top view direction of the substrate to define the at least one opening.