H10W 72/50
Bond wires
H10W72/50 (Bond wires) appears on 35,102 US grants and 34,589 published applications in this corpus.
Search patents in H10W- Granted patents
- 35,102
- Published applications
- 34,589
- Assignees
- 4,042
- Inventors
- 41,780
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 56 | 0 |
| 1977 | 56 | 0 |
| 1978 | 41 | 0 |
| 1979 | 28 | 0 |
| 1980 | 37 | 0 |
| 1981 | 33 | 0 |
| 1982 | 36 | 0 |
| 1983 | 46 | 0 |
| 1984 | 59 | 0 |
| 1985 | 78 | 0 |
| 1986 | 82 | 0 |
| 1987 | 114 | 0 |
| 1988 | 114 | 0 |
| 1989 | 159 | 0 |
| 1990 | 163 | 0 |
| 1991 | 233 | 0 |
| 1992 | 268 | 0 |
| 1993 | 265 | 0 |
| 1994 | 327 | 0 |
| 1995 | 347 | 0 |
| 1996 | 385 | 0 |
| 1997 | 440 | 0 |
| 1998 | 571 | 0 |
| 1999 | 630 | 0 |
| 2000 | 726 | 0 |
| 2001 | 885 | 445 |
| 2002 | 1023 | 1418 |
| 2003 | 1152 | 1384 |
| 2004 | 1249 | 1498 |
| 2005 | 1094 | 1626 |
| 2006 | 1118 | 1481 |
| 2007 | 1040 | 1578 |
| 2008 | 877 | 1632 |
| 2009 | 968 | 1636 |
| 2010 | 1369 | 1644 |
| 2011 | 1492 | 1573 |
| 2012 | 1379 | 1528 |
| 2013 | 1433 | 1481 |
| 2014 | 1526 | 1527 |
| 2015 | 1465 | 1610 |
| 2016 | 1487 | 1432 |
| 2017 | 1466 | 1400 |
| 2018 | 1265 | 1285 |
| 2019 | 1300 | 1250 |
| 2020 | 1181 | 1416 |
| 2021 | 1032 | 1196 |
| 2022 | 1022 | 1221 |
| 2023 | 881 | 1041 |
| 2024 | 850 | 1152 |
| 2025 | 737 | 733 |
| 2026 | 517 | 402 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bondable pillars for wire bonds in a semiconductor package6 Oct 2026US 12,757,414 B2Micron Technology, Inc.
- Memory device package having scribe line and method for manufacturing the same6 Oct 2026US 12,757,742 B2Nanya Technology Corporation
- Press pack power semiconductor device with locator strip6 Oct 2026US 12,757,743 B2Littelfuse, Inc.
- Electronic device with high draft angle package structure6 Oct 2026US 12,757,753 B2Texas Instruments Incorporated
- Power semiconductor package6 Oct 2026US 12,757,757 B2Pierburg GmbH
- Semiconductor device having a layered source pad8 Oct 2026US 2026/0314377 A1Microchip Technology Incorporated
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Power module with selective heat spreader8 Oct 2026US 2026/0314407 A1Microchip Technology Incorporated
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Connecting semiconductor dies through traces8 Oct 2026US 2026/0314460 A1Micron Technology, Inc.
Most cited
By later US patents
- Non-protruding optoelectronic lens1,266US 6,525,386 B1Masimo Corporation · 2003
- Implantable microstimulator1,104US 5,193,539 AAlfred E. Mann Foundation for Scientific Research · 1993
- Polarless surface mounting light emitting diode1,041US 7,714,334 B22010
- Mold tool for an optoelectronic element1,037US 6,830,711 B2Masimo Corporation · 2004
- Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material1,017US 5,998,925 ANichia Kagaku Kogyo K. K. · 1999