H10W 72/531
Shapes of wire connectors
Official title: {Shapes of wire connectors}
H10W72/531 (Shapes of wire connectors) appears on 13,320 US grants and 12,550 published applications in this corpus.
Search patents in H10W- Granted patents
- 13,320
- Published applications
- 12,550
- Assignees
- 2,071
- Inventors
- 18,558
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 31 | 0 |
| 1977 | 24 | 0 |
| 1978 | 24 | 0 |
| 1979 | 15 | 0 |
| 1980 | 21 | 0 |
| 1981 | 12 | 0 |
| 1982 | 22 | 0 |
| 1983 | 23 | 0 |
| 1984 | 30 | 0 |
| 1985 | 33 | 0 |
| 1986 | 41 | 0 |
| 1987 | 62 | 0 |
| 1988 | 56 | 0 |
| 1989 | 70 | 0 |
| 1990 | 68 | 0 |
| 1991 | 101 | 0 |
| 1992 | 112 | 0 |
| 1993 | 116 | 0 |
| 1994 | 166 | 0 |
| 1995 | 145 | 0 |
| 1996 | 171 | 0 |
| 1997 | 178 | 0 |
| 1998 | 235 | 0 |
| 1999 | 233 | 0 |
| 2000 | 296 | 0 |
| 2001 | 342 | 180 |
| 2002 | 390 | 492 |
| 2003 | 407 | 546 |
| 2004 | 454 | 597 |
| 2005 | 416 | 674 |
| 2006 | 465 | 681 |
| 2007 | 462 | 702 |
| 2008 | 406 | 697 |
| 2009 | 413 | 688 |
| 2010 | 622 | 700 |
| 2011 | 661 | 636 |
| 2012 | 569 | 575 |
| 2013 | 576 | 548 |
| 2014 | 586 | 556 |
| 2015 | 541 | 610 |
| 2016 | 547 | 512 |
| 2017 | 549 | 514 |
| 2018 | 445 | 422 |
| 2019 | 409 | 377 |
| 2020 | 373 | 393 |
| 2021 | 290 | 336 |
| 2022 | 303 | 390 |
| 2023 | 243 | 236 |
| 2024 | 254 | 212 |
| 2025 | 203 | 163 |
| 2026 | 109 | 113 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/536The connected ends being ball-shaped9,081
- H10W 72/5363The connected ends being wedge-shaped8,901
- H10W 72/5366The bond wires having kinks1,332
- H10W 72/533Cross-sectional shape1,097
- H10W 72/537Multiple bond wires having different shapes708
- H10W 72/5368The bond wires having helical loops53
- H10W 72/535Shapes of outermost layers of multilayered bond wires5
Recent patents
- Press pack power semiconductor device with locator strip6 Oct 2026US 12,757,743 B2Littelfuse, Inc.
- Electronic device with high draft angle package structure6 Oct 2026US 12,757,753 B2Texas Instruments Incorporated
- Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices29 Sep 2026US 12,751,297 B2Infineon Technologies Austria AG
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Offset interposers for large-bottom packages and large-die package-on-package structures8 Sep 2026US 12,733,556 B2Intel Corporation
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Connecting semiconductor dies through traces8 Oct 2026US 2026/0314460 A1Micron Technology, Inc.
- Semiconductor package having a multi-layer film structure8 Oct 2026US 2026/0314477 A1SanDisk Technologies LLC
- Semiconductor device with an embedded passive component and method of making the same8 Oct 2026US 2026/0314485 A1Texas Instruments Incorporated
- Microelectronic device package with open cavity1 Oct 2026US 2026/0305456 A1Texas Instruments Incorporated
Most cited
By later US patents
- Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material1,017US 5,998,925 ANichia Kagaku Kogyo K. K. · 1999
- Radio frequency circuit and memory in thin flexible package895US 5,528,222 AInternational Business Machines Corporation · 1996
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Multiple wavelength optical sensor770US 8,781,544 B2Cercacor Laboratories, Inc. · 2014
- Wavelength-converting casting composition and its use749US 6,066,861 ASiemens Aktiengesellschaft · 2000