H10W 72/5366
The bond wires having kinks
Official title: {the bond wires having kinks}
H10W72/5366 (The bond wires having kinks) appears on 1,332 US grants and 1,384 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,332
- Published applications
- 1,384
- Assignees
- 389
- Inventors
- 2,241
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 6 | 0 |
| 1993 | 8 | 0 |
| 1994 | 7 | 0 |
| 1995 | 11 | 0 |
| 1996 | 10 | 0 |
| 1997 | 5 | 0 |
| 1998 | 8 | 0 |
| 1999 | 18 | 0 |
| 2000 | 26 | 0 |
| 2001 | 30 | 14 |
| 2002 | 31 | 42 |
| 2003 | 35 | 60 |
| 2004 | 58 | 61 |
| 2005 | 41 | 77 |
| 2006 | 39 | 72 |
| 2007 | 52 | 76 |
| 2008 | 47 | 77 |
| 2009 | 37 | 100 |
| 2010 | 89 | 97 |
| 2011 | 85 | 76 |
| 2012 | 77 | 77 |
| 2013 | 65 | 49 |
| 2014 | 66 | 70 |
| 2015 | 57 | 74 |
| 2016 | 65 | 52 |
| 2017 | 55 | 55 |
| 2018 | 58 | 46 |
| 2019 | 35 | 37 |
| 2020 | 38 | 33 |
| 2021 | 33 | 37 |
| 2022 | 29 | 40 |
| 2023 | 21 | 26 |
| 2024 | 19 | 19 |
| 2025 | 24 | 12 |
| 2026 | 18 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wire bonds for galvanic isolation device18 Aug 2026US 12,713,629 B2Texas Instruments Incorporated
- Semiconductor package23 Jun 2026US 12,667,004 B2Changxin Memory Technologies, Inc.
- Tablet ultrasound system16 Jun 2026US 12,653,504 B2TeraTech Corporation
- Power module package with molded via and dual side press-fit pin16 Jun 2026US 12,660,722 B2Semiconductor Components Industries, LLC
- Electronic chips with surface mount component2 Jun 2026US 12,648,228 B2STMicroelectronics (Alps) SAS
- Power module package with molded via and dual side press-fit pin1 Oct 2026US 2026/0305495 A1Semiconductor Components Industries, LLC
- Semiconductor device10 Sep 2026US 2026/0271767 A1Rohm Co., Ltd.
- Semiconductor device27 Aug 2026US 2026/0255975 A1Kioxia Corporation
- Method of manufacturing a semiconductor package and semiconductor package manufactured by the same21 May 2026US 2026/0143722 A1SK hynix Inc.
- Semiconductor device and method for manufacturing semiconductor device9 Apr 2026US 2026/0101803 A1Rohm Co., Ltd.
Most cited
By later US patents
- Methods for manufacturing a semiconductor package having a sacrificial layer553US 6,001,671 ATessera, Inc. · 1999
- Wafer level stack structure for system-in-package and method thereof377US 7,215,033 B2Samsung Electronics Co., Ltd. · 2007
- Chip stack package and manufacturing method thereof368US 7,276,799 B2Samsung Electronics Co., Ltd. · 2007
- Multichip module having a stacked chip arrangement358US 5,323,060 AMicron Semiconductor, Inc. · 1994
- Thin stacked interposer package352US 7,777,351 B1Amkor Technology, Inc. · 2010