Semiconductor package

A semiconductor package, comprising:

• a first base plate, having a first surface, wherein the first surface comprises a first signal transmission region and a second signal transmission region, the first signal transmission region and the second signal transmission region are located at two opposite sides of the first base plate;
• a first semiconductor structure, located on the first surface of the first base plate and has a first connection end, the first connection end and the first signal transmission region are located at a same side and connected to each other by using a lead wire;
• a second base plate, located on the first base plate and comprising a base and a first interconnection surface located on the base, wherein the first interconnection surface of the second base plate is away from the first surface of the first base plate, the first interconnection surface has a first interconnection region and a second interconnection region that communicate with each other, the second interconnection region and the second signal transmission region are located at a same side and connected to each other by using a lead wire;
• and
• a filling layer, sealing the first semiconductor structure, the second base plate and the first surface of the first base plate, wherein the first interconnection region is not sealed by the filling layer, the second interconnection region is sealed by the filling layer, and there is a preset height between a top surface of the filling layer on the second interconnection region and the first interconnection region.