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US 12,648,228 B2Granted
Electronic chips with surface mount component
AssigneesSTMicroelectronics France, STMicroelectronics (Alps) SAS
InventorsJeremie Forest, Vincent Knopik, Laurent Schwartz
Life of this patent
Estimating the term…
Abstract
Electronic chip comprising a first integrated circuit, a second integrated circuit, a first link connecting the first integrated circuit and the second integrated circuit, a second link connecting the first integrated circuit and the second integrated circuit, a surface-mount component, the component being configured and placed to limit an electromagnetic disturbance by the first link of the second link.
Claims20
An electronic chip comprising:
- a first integrated circuit;
- a second integrated circuit;
- a first link configured to transmit a first signal and connecting the first integrated circuit and the second integrated circuit;
- a second link configured to transmit a second signal and connecting the first integrated circuit and the second integrated circuit;
- and
- a surface-mount component disposed between but not directly connected to the first and second links,
- wherein the first link and the second link are partially disposed on opposite sides of the surface-mount component,
- wherein the surface-mount component, the first integrated circuit, and the second integrated circuit are directly mounted on a first face of a flat support, and
- wherein each of the first link and the second link is directly connected to the first and second integrated circuits and contained within a volume between the first face of the flat support and a plane extending from a top face of the surface-mount component that is farthest from and parallel to the flat support.
6 more elements
An electronic chip comprising:
- a first integrated circuit;
- a second integrated circuit;
- a first link configured to transmit a first signal and connecting the first integrated circuit and the second integrated circuit;
- a second link configured to transmit a second signal and connecting the first integrated circuit and the second integrated circuit;
- and
- a surface-mount component,
- wherein the first integrated circuit, the second integrated circuit, and the surface-mount component are directly fastened onto a first face of a flat support,
- wherein the surface-mount component is fastened within a four-sided zone of the flat support defined by the first link, the second link, a first edge of the first integrated circuit, and a second edge of the second integrated circuit, and
- wherein each of the first link and the second link is directly connected to the first and second integrated circuits and contained within a volume between the first face of the flat support and a plane extending from a top face of the surface-mount component that is farthest from and parallel to the flat support.
6 more elements
An electronic chip comprising:
- a substrate;
- a first integrated circuit directly attached to a first side of the substrate;
- a second integrated circuit directly attached to the first side of the substrate;
- a first electrical signal connection located above the first side of the substrate and directly interconnecting the first integrated circuit with the second integrated circuit;
- a second electrical signal connection located above the first side of the substrate and directly interconnecting the first integrated circuit with the second integrated circuit;
- a first surface-mount component directly attached to the first side of the substrate,
- wherein the first surface-mount component is disposed between but not directly connected to the first electrical signal connection and the second electrical signal connection,
- wherein the first electrical signal connection and the second electrical signal connection are partially disposed on opposite sides of the first surface-mount component;
- and
- a second surface-mount component attached to the first surface-mount component but not directly connected to the first electrical signal connection and the second electrical signal connection,
- wherein the first surface-mount component is disposed between the first side of the substrate and the second surface-mount component, and
- wherein the second surface-mount component has a second uppermost surface above the first electrical signal connection and the second electrical signal connection.
9 more elements
Dependencies are inferred from the claim text.