Semiconductor device

A semiconductor device comprising:

• a substrate having a major surface, the substrate including a first region, and a second region provided in such a manner as to surround an outer periphery of the first region as viewed in a first direction, the first direction being a direction perpendicular to the major surface;
• a semiconductor circuit provided in the first region on the substrate;
• a first conductive pillar extending in the first direction in the second region on the substrate;
• a passivation film provided in the first region and overlapping the semiconductor circuit in the first direction, the passivation film being provided on an opposite side to the substrate in the first direction with respect to the semiconductor circuit and the first conductive pillar;
• a pad provided in an opening portion passing through the passivation film in the first direction in the first region, and coupled to the semiconductor circuit;
• and
• an interconnect coupled at one end to the pad and coupled at the other end to an external terminal, wherein
• the first conductive pillar is exposed from the passivation film,
• at least a part of the interconnect passes over a position overlapping the first conductive pillar in the first direction, and
• a width of the first conductive pillar as viewed in the first direction is equal to or less than a width of the interconnect.