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US 12,660,722 B2Granted
Power module package with molded via and dual side press-fit pin
AssigneeSemiconductor Components Industries, LLC
InventorsHeejo Chi, Seungwon Im, Oseob Jeon
Life of this patent
Estimating the term…
Abstract
A module includes an assembly of a semiconductor device die, a lead frame connected to the semiconductor device die, and a substrate connected to the lead frame. The substrate includes at least one plated-through hole (PTH). A mold body encapsulates the assembly. The mold body includes a through-mold via (TMV) aligned with a portion of the substrate including the at least one PTH. The PTH is exposed in the TMV to an environment outside the mold body and is physically accessible from outside the mold body through the TMV.
Claims21
A module comprising:
- an assembly including a semiconductor device die, a lead frame connected to the semiconductor device die, and a substrate connected to the lead frame, the substrate including at least one plated-through hole (PTH);
- and
- a mold body encapsulating the assembly, the mold body including a through-mold via (TMV) aligned with a portion of the substrate including the at least one PTH, the PTH being exposed in the TMV to an environment outside the mold body and being physically accessible from outside the mold body through the TMV.
A module comprising:
- a power device encapsulated in a mold body;
- and
- a press-fit pin coupler disposed outside the mold body in a through-mold via (TMV), the press-fit pin coupler being physically accessible from outside the mold body through the TMV, the press-fit pin coupler being electrically connected to the power device encapsulated in the mold body.
A method comprising:
- forming an assembly including a semiconductor device die, at least a lead frame connected to the semiconductor device die, and a substrate connected to the lead frame, the substrate including at least one plated-through hole (PTH);
- and
- encapsulating the assembly in a mold body with a through-mold via (TMV) aligned with a portion of the substrate including the at least one plated-through hole (PTH), the PTH being exposed in the TMV to an environment outside the mold body and being physically accessible from outside the mold body through the TMV.
Dependencies are inferred from the claim text.