Semiconductor device

A semiconductor device, comprising:

• a first die pad having a first mounting surface facing one side in a first direction;
• a first semiconductor element including a first electrode located on an opposite side of the one side to which the first mounting surface faces in the first direction, the first semiconductor element being mounted on the first mounting surface;
• a plurality of first leads each having a first connection surface facing the one side to which the first mounting surface faces in the first direction, the plurality of first leads being spaced apart from the first die pad;
• and
• a first wire conductively joined to the first electrode and the first connection surface of one of the plurality of first leads,
• wherein the first wire includes a first connection portion conductively joined to the first electrode, a second connection portion conductively joined to the first connection surface, a first bent portion located between the first connection portion and the second connection portion, a second bent portion located between the first bent portion and the second connection portion, and a third bent portion located between the second bent portion and the second connection portion,
• wherein each of the first bent portion and the second bent portion has a convex shape facing toward the side moving away from the first mounting surface, and
• wherein the third bent portion has a convex shape facing a side approaching the first mounting surface.