H10W 72/535
Shapes of outermost layers of multilayered bond wires
Official title: {Shapes of outermost layers of multilayered bond wires, e.g. coating not being conformal on a core}
H10W72/535 (Shapes of outermost layers of multilayered bond wires) appears on 5 US grants and 12 published applications in this corpus.
Search patents in H10W- Granted patents
- 5
- Published applications
- 12
- Assignees
- 10
- Inventors
- 29
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2016 | 1 | 2 |
| 2017 | 1 | 0 |
| 2018 | 0 | 2 |
| 2019 | 0 | 0 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 1 |
| 2024 | 0 | 2 |
| 2025 | 1 | 2 |
| 2026 | 1 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Bonding wire for semiconductor devices8 Sep 2026US 12,733,530 B2Nippon Micrometal Corporation
- Semiconductor device including bonding covers19 Aug 2025US 12,394,745 B2Semiconductor Components Industries, LLC
- Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire19 May 2020US 10,658,326 B2Samsung Electronics Co., Ltd.
- Electronic device having a lead with selectively modified electrical properties6 Jun 2017US 9,673,137 B2Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Coated bonding wire and methods for bonding using same14 Jun 2016US 9,368,470 B2Freescale Semiconductor, Inc.
- High bandwidth 3d mesh interconnect structure1 Oct 2026US 2026/0305499 A1Atum Works Inc.
- Semiconductor package and manufacturing method thereof30 Apr 2026US 2026/0123537 A1SK hynix Inc.
- Bonding wire for semiconductor devices4 Dec 2025US 2025/0372565 A1Nippon Micrometal Corporation
- Semiconductor apparatus and method for manufacturing the same, and power conversion apparatus12 Jun 2025US 2025/0192098 A1Mitsubishi Electric Corporation
- Bonding wire for semiconductor devices5 Sep 2024US 2024/0297142 A1Nippon Micrometal Corporation
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.