Semiconductor apparatus and method for manufacturing the same, and power conversion apparatus
AssigneeMitsubishi Electric Corporation
InventorYuji SATO
Life of this patent
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Abstract
A semiconductor apparatus includes a semiconductor device, a lower wire member, and an upper wire member. The semiconductor device includes a semiconductor device body having a main surface, and a metal layer. The lower wire member includes an end surface and an end surface. In a plan view of the main surface, the end surface and the end surface are located inside a periphery of the semiconductor device. The upper wire member is stacked on the lower wire member. In the plan view of the main surface, a portion of the upper wire member is located outside the periphery of the semiconductor device. The upper wire member is joined to the metal layer with the lower wire member being interposed therebetween.
Claims15
A semiconductor apparatus comprising:
- a semiconductor device including a semiconductor device body having a main surface, and a metal layer provided on the main surface;
- a lower wire member;
- and
- an upper wire member, wherein
- the lower wire member includes a first end surface and a second end surface opposite to the first end surface, the first end surface and the second end surface are both end surfaces of the lower wire member in a longitudinal direction of the upper wire member, and in a plan view of the main surface, the first end surface and the second end surface are located inside a periphery of the semiconductor device,
- the upper wire member is stacked on the lower wire member, and in the plan view of the main surface, a portion of the upper wire member is located outside the periphery of the semiconductor device,
- the upper wire member is joined to the metal layer with the lower wire member being interposed therebetween, and
- at least one of the first end surface and the second end surface is not in contact with both the metal layer and the upper wire member and is separated from both the metal layer and the upper wire member.
4-5. (canceled)
8-15. (canceled)
A method for manufacturing a semiconductor apparatus, the method comprising:
- temporarily joining a lower wire member to a metal layer of a semiconductor device,
- the semiconductor device including a semiconductor device body having a main surface, and the metal layer provided on the main surface, the lower wire member including a first end surface and a second end surface opposite to the first end surface, in a plan view of the main surface, the first end surface and the second end surface being located inside a periphery of the semiconductor device;
- stacking an upper wire member on the lower wire member, in the plan view of the main surface, a portion of the upper wire member being located outside the periphery of the semiconductor device, the first end surface and the second end surface being both end surfaces of the lower wire member in a longitudinal direction of the upper wire member;
- and
- permanently joining the upper wire member to the metal layer of the semiconductor device with the lower wire member being interposed therebetween,
- wherein at least one of the first end surface and the second end surface is not in contact with both the metal layer and the upper wire member and is separated from both the metal layer and the upper wire member.
Dependencies are inferred from the claim text.