Semiconductor device including bonding covers
AssigneeSemiconductor Components Industries, LLC
InventorsWuxing Xia, Ye Jin
Life of this patent
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Abstract
A semiconductor device includes a die pad, a bond post, a die disposed over the die pad, a wire coupled between the die and the bond post and having a first portion bonded to the die at a first bond area and a second portion bonded to the bond post at a second bond area, a first bonding cover disposed over the first portion, and a second bonding cover disposed over the second portion. A method includes bonding a first portion of a wire to a die at a first bond area, bonding a second portion of the wire to a first bond post of a lead frame at a second bond area, applying a bonding material over the first bond area to form a first bonding cover, and applying the bonding material over the second bond area to form a second bonding cover.
Claims22
A semiconductor device, comprising:
- a lead frame including a die pad, a first bond post, and a first lead conductor coupled to the first bond post;
- a die disposed over the die pad;
- a first wire coupled between the die and the first bond post, the first wire having a first portion bonded to the die at a first bond area and a second portion bonded to the first bond post at a second bond area;
- a first bonding cover disposed over the first portion of the first wire, the first bonding cover having a length greater than a thickness of the first bonding cover;
- and
- a second bonding cover disposed over the second portion of the first wire.
A package device, comprising:
- a lead frame including a die pad, a first bond post, a second bond post, a first lead conductor coupled to the first bond post, and a second lead conductor coupled to the second bond post;
- a die disposed on the die pad;
- a first wire coupled between the die and the first bond post, the first wire having a first portion bonded to the die at a first bond area and a second portion bonded to the first bond post at a second bond area;
- a second wire coupled between the die and the second bond post, the second wire having a third portion bonded to the die at a third bond area;
- a first bonding cover disposed over the first portion of the first wire such that the first wire extends from the first bonding cover below a top surface of the first bonding cover;
- a second bonding cover disposed over the second portion of the first wire;
- a third bonding cover disposed over the third portion of the second wire;
- and
- a molded housing encapsulating the die.
A method, the method comprising:
- bonding a first portion of a wire to a die at a first bond area;
- bonding a second portion of the wire to a first bond post of a lead frame at a second bond area;
- applying a bonding material over the first bond area to form a first bonding cover having a thickness that tapers along a length of the first bonding cover;
- and
- applying the bonding material over the second bond area to form a second bonding cover.
Dependencies are inferred from the claim text.