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US 9,673,137 B2Granted
Electronic device having a lead with selectively modified electrical properties
AssigneeRosenberger Hochfrequenztechnik GmbH & Co. KG
InventorsSean S. Cahill, Eric A. Sanjuan
Life of this patent
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Abstract
A die package having a plurality of connection pads, a die substrate supporting a plurality of connection elements, a first lead having a first metal core with a first core diameter, and a dielectric layer surrounding the first metal core, the dielectric layer having a first dielectric thickness that varies along its length and/or the dielectric layer having an outer metal layer at least partially surrounding the dielectric layer, for selectively modifying the electrical characteristics of the lead.
Claims15
A die package comprising:
- a die having a plurality of connection pads;
- a die substrate supporting a plurality of connection elements;
- a first lead having a first metal core attached to a connection pad of the die and to a connection element of the die substrate with a first core diameter, and a conformal dielectric layer surrounding the first metal core, the conformal dielectric layer having a first dielectric thickness that varies along the length of the first lead and the conformal dielectric layer having an outer metal layer surrounding the conformal dielectric layer, for selectively modifying the electrical characteristics of the lead, the conformal dielectric layer being patterned or structured to a predetermined depth, while a thin dielectric layer surrounding the first metal core is still left, in defined areas along the lead.
Dependencies are inferred from the claim text.