High bandwidth 3d mesh interconnect structure

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A device package comprising:

• at least one element comprising a first contact pad having a first contact surface and a second contact pad having a second contact surface;
• an interconnect structure comprising an at least partially annular conductive wire disposed about an insulator, the at least partially annular conductive wire extending between and electrically connecting the first and second contact pads,
• wherein the at least partially annular conductive wire connects to the first and second contact pads at respective non-zero angles relative to the first and second contact surfaces, and wherein the at least partially annular conductive wire is continuous and seamless along a length between the first and second contact pads.

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A device package comprising:

• an interconnect structure comprising a scaffold, wherein the scaffold comprises an uncoated dielectric structure and a coated polymer structure, wherein the coated polymer structure comprises a first coating, the coated polymer structure to provide a plurality of electrical pathways including a first electrical pathway;
• and
• at least one element including a first contact pad and a second contact pad, wherein the interconnect structure electrically connects the first contact pad with the second contact pad through at least the first electrical pathway.

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