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US 12,733,556 B2Granted
Offset interposers for large-bottom packages and large-die package-on-package structures
AssigneeIntel Corporation
InventorsRussell K. Mortensen, Robert M. Nickerson, Nicholas R. Watts
Life of this patent
Estimating the term…
Abstract
An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side BGA includes two adjacent, spaced-apart land-side pads, and the POP-side BGA includes two adjacent, spaced-apart POP-side pads that are coupled to the respective two land-side BGA pads through the offset interposer. The land-side BGA is configured to interface with a first-level interconnect. The POP-side BGA is configured to interface with a POP substrate. Each of the two land-side pads has a different footprint than the respective two POP-side pads.
Claims20
A package, comprising:
- a first layer of interconnects;
- a second layer of interconnects coupled to the first layer of interconnects, the second layer of interconnects having a through hole therein and an inner edge surrounding the through hole, the second layer of interconnects having a first plurality of conductive pads above a second plurality of conductive pads, and a plurality of conductive vias coupling the first plurality of conductive pads to the second plurality of conductive pads;
- an electronic device in the through hole of the second layer of interconnects, the electronic device coupled to the first layer of interconnects, and the electronic device having a lateral width;
- a third layer of interconnects over the second layer of interconnects and over the electronic device;
- and
- a die coupled to the third layer of interconnects by a plurality of contacts, the die vertically over the electronic device, the die having a lateral width greater than and covering an entirety of the lateral width of the electronic device, and the die vertically overlapping the second layer of interconnects, wherein one or more of the plurality of contacts are vertically between the die and the second layer of interconnects, and wherein one or more of the plurality of contacts vertically overlaps with the electronic device.
3 more elements
A method of fabricating a package, the method comprising:
- forming a first layer of interconnects;
- forming a second layer of interconnects coupled to the first layer of interconnects, the second layer of interconnects having a through hole therein and an inner edge surrounding the through hole, the second layer of interconnects having a first plurality of conductive pads above a second plurality of conductive pads, and a plurality of conductive vias coupling the first plurality of conductive pads to the second plurality of conductive pads;
- providing an electronic device in the through hole of the second layer of interconnects, the electronic device coupled to the first layer of interconnects, and the electronic device having a lateral width;
- forming a third layer of interconnects over the second layer of interconnects and over the electronic device;
- and
- coupling a die to the third layer of interconnects by a plurality of contacts, the die vertically over the electronic device, the die having a lateral width greater than and covering an entirety of the lateral width of the electronic device, and the die vertically overlapping the second layer of interconnects, wherein one or more of the plurality of contacts are vertically between the die and the second layer of interconnects, and wherein one or more of the plurality of contacts vertically overlaps with the electronic device.
3 more elements
A package, comprising:
- a first layer of interconnects;
- an interposer coupled to the first layer of interconnects, the interposer having a through hole therein and an inner edge surrounding the through hole, the interposer having a first plurality of conductive pads above a second plurality of conductive pads, and a plurality of conductive vias coupling the first plurality of conductive pads to the second plurality of conductive pads;
- an electronic device in the through hole of the interposer, the electronic device coupled to the first layer of interconnects, and the electronic device having a lateral width;
- a second layer of interconnects over the interposer and over the electronic device;
- and
- a die coupled to the second layer of interconnects by a plurality of contacts, the die vertically over the electronic device, and the die having a lateral width greater than and covering an entirety of the lateral width of the electronic device, and the die vertically overlapping the interposer, wherein one or more of the plurality of contacts are vertically between the die and the interposer, and wherein one or more of the plurality of contacts are vertically between the die and the electronic device.
3 more elements
Dependencies are inferred from the claim text.