H10W 72/537
Multiple bond wires having different shapes
Official title: {Multiple bond wires having different shapes}
H10W72/537 (Multiple bond wires having different shapes) appears on 708 US grants and 781 published applications in this corpus.
Search patents in H10W- Granted patents
- 708
- Published applications
- 781
- Assignees
- 250
- Inventors
- 1,427
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 6 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 7 | 0 |
| 2001 | 12 | 9 |
| 2002 | 16 | 23 |
| 2003 | 11 | 25 |
| 2004 | 25 | 15 |
| 2005 | 16 | 34 |
| 2006 | 20 | 38 |
| 2007 | 16 | 40 |
| 2008 | 21 | 45 |
| 2009 | 31 | 48 |
| 2010 | 30 | 38 |
| 2011 | 36 | 33 |
| 2012 | 42 | 27 |
| 2013 | 28 | 19 |
| 2014 | 28 | 33 |
| 2015 | 33 | 34 |
| 2016 | 29 | 26 |
| 2017 | 24 | 34 |
| 2018 | 29 | 32 |
| 2019 | 36 | 39 |
| 2020 | 32 | 42 |
| 2021 | 27 | 31 |
| 2022 | 39 | 31 |
| 2023 | 25 | 31 |
| 2024 | 15 | 23 |
| 2025 | 18 | 17 |
| 2026 | 18 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device comprising a leadframe adapted for higher current output or improved placement of additional devices29 Sep 2026US 12,751,297 B2Infineon Technologies Austria AG
- Methods related to dual-sided radio-frequency package with overmold structure25 Aug 2026US 12,721,179 B2Skyworks Solutions, Inc.
- Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies25 Aug 2026US RE51,016 E1Adeia Semiconductor Technologies LLC
- Wire bonds for galvanic isolation device18 Aug 2026US 12,713,629 B2Texas Instruments Incorporated
- Semiconductor device and method of die attach with adhesive layer containing graphene-coated core11 Aug 2026US 12,708,038 B2STATS ChipPAC Pte. Ltd.
- Connecting semiconductor dies through traces8 Oct 2026US 2026/0314460 A1Micron Technology, Inc.
- Semiconductor device10 Sep 2026US 2026/0271767 A1Rohm Co., Ltd.
- Semiconductor device30 Jul 2026US 2026/0223719 A1Sumitomo Electric Device Innovations, Inc.
- Irregular direct bonded metal (dbm) and connection substrate16 Jul 2026US 2026/0206584 A1Semiconductor Components Industries, LLC
- Semiconductor package11 Jun 2026US 2026/0165202 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Plural semiconductor die housed in common package with split heat sink266US 5,977,630 AInternational Rectifier Corporation · 1999
- Semiconductor device and method for manufacturing the same266US 6,307,272 B1Hitachi, Ltd. · 2001
- Semiconductor device and method of manufacturing the same219US 6,100,594 ASharp Kabushiki Kaisha · 2000
- Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies177US 9,824,974 B2Invensas Corporation · 2017
- Integrated circuit with bonding layer over active circuitry140US 6,683,380 B2Texas Instruments Incorporated · 2004