H10W 72/5368
The bond wires having helical loops
Official title: {the bond wires having helical loops}
H10W72/5368 (The bond wires having helical loops) appears on 53 US grants and 49 published applications in this corpus.
Search patents in H10W- Granted patents
- 53
- Published applications
- 49
- Assignees
- 40
- Inventors
- 117
- Latest grant
- 28 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 2 |
| 2004 | 2 | 0 |
| 2005 | 1 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 2 |
| 2008 | 0 | 2 |
| 2009 | 2 | 2 |
| 2010 | 3 | 6 |
| 2011 | 6 | 2 |
| 2012 | 2 | 3 |
| 2013 | 1 | 2 |
| 2014 | 1 | 0 |
| 2015 | 2 | 8 |
| 2016 | 5 | 3 |
| 2017 | 2 | 2 |
| 2018 | 1 | 1 |
| 2019 | 3 | 3 |
| 2020 | 2 | 3 |
| 2021 | 3 | 3 |
| 2022 | 2 | 2 |
| 2023 | 1 | 0 |
| 2024 | 2 | 2 |
| 2025 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- 3D printed semiconductor package28 Oct 2025US 12,457,756 B2Texas Instruments Incorporated
- Switching module14 Jan 2025US 12,199,467 B2Delta Electronics (Shanghai) Co., Ltd.
- Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits23 Apr 2024US 11,967,569 B2Texas Instruments Incorporated
- 3D printed semiconductor package9 Jan 2024US 11,869,925 B2Texas Instruments Incorporated
- Wirebond-constructed inductors1 Aug 2023US 11,715,722 B2Wolfspeed, Inc.
- 3d printed semiconductor package2 May 2024US 2024/0145526 A1Texas Instruments Incorporated
- Wireless implantable sensing devices1 Feb 2024US 2024/0032867 A1The Board of Trustees of the Leland Stanford Junior University
- Switching module15 Sep 2022US 2022/0294261 A1Delta Electronics (Shanghai) Co., Ltd.
- Ex-situ manufacture of metal micro-wires and fib placement in ic circuits7 Apr 2022US 2022/0108960 A1Texas Instruments Incorporated
- Wirebond-Constructed Inductors4 Nov 2021US 2021/0343679 A1Cree, Inc.
Most cited
By later US patents
- Integrated circuit device including means for facilitating connection of antenna lead wires to an integrated circuit die78US 5,281,855 ATrovan Limited · 1994
- Semiconductor package having optimized wire bond positioning58US 6,812,580 B1Freescale Semiconductor, Inc. · 2004
- Apparatus for facilitating interconnection of antenna lead wires to an integrated circuit and encapsulating the assembly to form an improved miniature transponder device53US 5,223,851 ATrovan Limited · 1993
- Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same32US 8,618,656 B2Hynix Semiconductor Inc. · 2013
- Twisted-pair wire bond and method thereof27US 5,459,284 AMotorola, Inc. · 1995