Wirebond-constructed inductors

A semiconductor package comprising:

• a surface and;
• Radio Frequency (RF) amplifier circuitry comprising:
• a first RF component comprising a first connection pad;
• a second RF component comprising a second connection pad;
• and
• at least one bondwire inductor that comprises:
• a dielectric structure comprising a base secured to the surface of the semiconductor package;
• and
• a bondwire interconnecting the first and second RF components, the bondwire comprising:
• a first end secured to the first connection pad;
• and
• a second end opposite the first end secured to the second connection pad;
• wherein the bondwire extends from the first connection pad at least partially around the dielectric structure a defined amount to the second connection pad to achieve an inductance between the first and second connection pads supporting impedance matching, harmonic termination, and/or biasing of input to, or output from, the RF amplifier circuitry.