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US 2024/0145526 A1Published application
3d printed semiconductor package
AssigneeTexas Instruments Incorporated
InventorsBenjamin Stassen Cook, Daniel Lee Revier
Life of this patent
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Abstract
In described examples, an integrated circuit comprises: a substrate; a semiconductor die on the substrate; and a device on the substrate and electrically coupled to the semiconductor die, the device including a polymer structure coated with a metal.
Claims20
An integrated circuit comprising:
- a substrate;
- a semiconductor die on the substrate;
- and
- a device on the substrate and electrically coupled to the semiconductor die, the device including a polymer structure coated with a metal.
1 more element
An integrated circuit comprising:
- a substrate;
- a semiconductor die on the substrate;
- and
- a device on the substrate and electrically coupled to the semiconductor die, the device including a polymerized material coated with a metal.
1 more element
Dependencies are inferred from the claim text.