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US 2022/0108960 A1Published application
Ex-situ manufacture of metal micro-wires and fib placement in ic circuits
AssigneeTexas Instruments Incorporated
InventorsMichael Lee Dawson, Edward J. Pryor, Jeffrey L. Large, Mary Coles
Life of this patent
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Abstract
A method includes attaching a first portion of a preformed metal micro-wire to a multilayer structure. The preformed metal micro-wire has a diameter of 10 microns or less. The method also includes attaching a second portion of the preformed metal micro-wire to the multilayer structure.
Claims20
A method comprising:
- attaching a first portion of a preformed metal micro-wire to a multilayer structure, the preformed metal micro-wire having a diameter of 10 microns or less;
- and
- attaching a second portion of the preformed metal micro-wire to the multilayer structure.
A method comprising:
- attaching a preformed metal micro-wire to a multilayer structure, the preformed metal micro-wire having a diameter of 10 microns or less, the attaching using a nanopositioner attached to the preformed metal micro-wire;
- and
- detaching the nanopositioner from the preformed metal micro-wire.
A method comprising:
- attaching a first portion of a preformed metal micro-wire to a first conductive element of a multilayer structure, the preformed metal micro-wire having a diameter of 10 microns or less;
- and
- attaching a second portion of the preformed metal micro-wire to a second conductive element of the multilayer structure.
The method of claim 19, wherein the concave shape extends over a third conductive element on the surface of the multilayer structure.
Dependencies are inferred from the claim text.