Semiconductor package having optimized wire bond positioning

A semiconductor package comprising:

• a first surface formed by a plurality of peripheral edges, the first surface having a first plurality of connection pads positioned along an axis that is substantially perpendicular to a predetermined one of the plurality of peripheral edges;
• a plurality of wires, each of the plurality of wires having a wire diameter and a first end electrically connected to a predetermined one of the first plurality of connection pads, any two of the plurality of wires having a wire-to-wire pitch measured at any point along the any two of the plurality of wires;
• and
• a second surface having a second plurality of connection pads positioned thereon, each of which is connected to a second end of a predetermined one of the plurality of wires, the plurality of wires positioned substantially along the axis by maintaining a separation pitch of no greater than three times the wire diameter for at least fifty percent of a length of a shortest wire of the plurality of wires.

A semiconductor package comprising:

• a first portion of a surface, the first portion having a plurality of connection pads positioned on the surface and along a predetermined axis;
• a plurality of wires, each of the plurality of wires having a first end electrically connected to a predetermined one of the plurality of connection pads, each of the plurality of wires having a diameter;
• and
• a second portion of the surface having a plurality of connection pads each of which is connected to a second end of a predetermined one of the plurality of wires, the plurality of wires positioned substantially along the axis and maintaining a separation distance from an adjacent one of the plurality of wires of no greater than twice a largest diameter of the plurality of wires along at least fifty percent of a length of a shortest wire of the plurality of wires.