H10W 72/5363
The connected ends being wedge-shaped
Official title: {the connected ends being wedge-shaped}
H10W72/5363 (The connected ends being wedge-shaped) appears on 8,901 US grants and 8,192 published applications in this corpus.
Search patents in H10W- Granted patents
- 8,901
- Published applications
- 8,192
- Assignees
- 1,548
- Inventors
- 12,885
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 17 | 0 |
| 1977 | 7 | 0 |
| 1978 | 14 | 0 |
| 1979 | 7 | 0 |
| 1980 | 15 | 0 |
| 1981 | 10 | 0 |
| 1982 | 18 | 0 |
| 1983 | 16 | 0 |
| 1984 | 17 | 0 |
| 1985 | 24 | 0 |
| 1986 | 35 | 0 |
| 1987 | 46 | 0 |
| 1988 | 41 | 0 |
| 1989 | 43 | 0 |
| 1990 | 50 | 0 |
| 1991 | 68 | 0 |
| 1992 | 89 | 0 |
| 1993 | 86 | 0 |
| 1994 | 131 | 0 |
| 1995 | 113 | 0 |
| 1996 | 130 | 0 |
| 1997 | 133 | 0 |
| 1998 | 175 | 0 |
| 1999 | 165 | 0 |
| 2000 | 210 | 0 |
| 2001 | 252 | 120 |
| 2002 | 277 | 379 |
| 2003 | 283 | 385 |
| 2004 | 309 | 433 |
| 2005 | 304 | 480 |
| 2006 | 354 | 492 |
| 2007 | 330 | 488 |
| 2008 | 276 | 472 |
| 2009 | 287 | 466 |
| 2010 | 440 | 476 |
| 2011 | 463 | 432 |
| 2012 | 379 | 396 |
| 2013 | 384 | 355 |
| 2014 | 375 | 338 |
| 2015 | 342 | 361 |
| 2016 | 309 | 315 |
| 2017 | 350 | 309 |
| 2018 | 282 | 244 |
| 2019 | 225 | 206 |
| 2020 | 202 | 223 |
| 2021 | 166 | 195 |
| 2022 | 169 | 237 |
| 2023 | 145 | 139 |
| 2024 | 167 | 116 |
| 2025 | 114 | 83 |
| 2026 | 57 | 52 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Offset interposers for large-bottom packages and large-die package-on-package structures8 Sep 2026US 12,733,556 B2Intel Corporation
- Semiconductor device1 Sep 2026US 12,727,488 B2Renesas Electronics Corporation
- Imaging element package, method of manufacturing the same, and electronic device25 Aug 2026US 12,720,878 B2Sony Semiconductor Solutions Corporation
- Semiconductor device25 Aug 2026US 12,721,209 B2Rohm Co., Ltd.
- Wire bonds for galvanic isolation device18 Aug 2026US 12,713,629 B2Texas Instruments Incorporated
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Semiconductor device with an embedded passive component and method of making the same8 Oct 2026US 2026/0314485 A1Texas Instruments Incorporated
- Semiconductor device24 Sep 2026US 2026/0293686 A1Rohm Co., Ltd.
- Radio frequency (rf) interconnect configuration for substrate and surface mount device27 Aug 2026US 2026/0255997 A1Ciena Corporation
- Capillary head with noncircular cone for wirebonding in semiconductor package manufacturing27 Aug 2026US 2026/0256014 A1
Most cited
By later US patents
- Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material1,017US 5,998,925 ANichia Kagaku Kogyo K. K. · 1999
- Radio frequency circuit and memory in thin flexible package895US 5,528,222 AInternational Business Machines Corporation · 1996
- Ceramic emitter substrate831US 8,355,766 B2Masimo Corporation · 2013
- Multiple wavelength optical sensor770US 8,781,544 B2Cercacor Laboratories, Inc. · 2014
- Wavelength-converting casting composition and its use749US 6,066,861 ASiemens Aktiengesellschaft · 2000