Semiconductor device

A semiconductor device comprising:

• a die pad having a first surface including a first region, a second region surrounding the first region in plan view, and a third region surrounding the second region in plan view;
• a semiconductor chip having a second surface facing the first surface of the die pad, a third surface opposite the second surface, and a plurality of electrodes arranged on the third surface, the semiconductor chip being mounted on the die pad at the first region;
• a plurality of leads arranged around the die pad in plan view;
• a plurality of wires electrically connected the plurality of electrodes with the plurality of leads, respectively;
• a first metal film provided in the second region of the die pad;
• a second metal film provided in the third region of the die pad, the second metal film being electrically connected with the first metal film through the die pad;
• and
• a sealing body sealing the semiconductor chip, the plurality of wires and the first surface of the die pad,
• wherein, in plan view, the semiconductor chip, the first metal film and the second metal film are spaced apart from one another, and
• wherein the plurality of wires includes:
• a first wire bonded to each of a first electrode of the plurality of electrodes and the first metal film;
• and
• a second wire bonded to each of a first lead of the plurality of leads and the second metal film.