H10W 72/581
Auxiliary members
Official title: {Auxiliary members, e.g. flow barriers}
H10W72/581 (Auxiliary members) appears on 254 US grants and 247 published applications in this corpus.
Search patents in H10W- Granted patents
- 254
- Published applications
- 247
- Assignees
- 137
- Inventors
- 570
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 9 | 0 |
| 1999 | 3 | 0 |
| 2000 | 5 | 0 |
| 2001 | 11 | 2 |
| 2002 | 7 | 8 |
| 2003 | 5 | 11 |
| 2004 | 3 | 3 |
| 2005 | 3 | 11 |
| 2006 | 8 | 12 |
| 2007 | 10 | 14 |
| 2008 | 6 | 15 |
| 2009 | 4 | 15 |
| 2010 | 12 | 18 |
| 2011 | 17 | 13 |
| 2012 | 19 | 11 |
| 2013 | 12 | 13 |
| 2014 | 8 | 11 |
| 2015 | 9 | 8 |
| 2016 | 11 | 8 |
| 2017 | 7 | 10 |
| 2018 | 8 | 6 |
| 2019 | 4 | 9 |
| 2020 | 8 | 7 |
| 2021 | 9 | 9 |
| 2022 | 6 | 11 |
| 2023 | 13 | 7 |
| 2024 | 2 | 5 |
| 2025 | 3 | 8 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor apparatus and semiconductor apparatus manufacturing method1 Sep 2026US 12,727,524 B2Fuji Electric Co., Ltd.
- Semiconductor device with wire including a surface metal layer covering a core metal11 Aug 2026US 12,708,043 B2Rohm Co., Ltd.
- Method of manufacturing a semiconductor package and semiconductor package manufactured by the same6 Jan 2026US 12,519,082 B2SK hynix Inc.
- Interconnect for IC package16 Sep 2025US 12,417,965 B2Texas Instruments Incorporated
- Semiconductor device with supporter against which bonding wire is disposed and method for preparing the same26 Aug 2025US 12,400,992 B2Nanya Technology Corporation
- Method of manufacturing a semiconductor package and semiconductor package manufactured by the same21 May 2026US 2026/0143722 A1SK hynix Inc.
- Semiconductor packages with plasma-etched scallops30 Apr 2026US 2026/0123532 A1
- Interconnect for ic package27 Nov 2025US 2025/0364381 A1
- Semiconductor chip30 Oct 2025US 2025/0336748 A1Samsung Electronics Co., Ltd.
- Integrated circuit package24 Jul 2025US 2025/0239496 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Semiconductor package with spacer strips202US 6,531,784 B1Amkor Technology, Inc. · 2003
- Stack package and method of fabricating the same190US 6,222,259 B1Hyundai Electronics Industries Co., Ltd. · 2001
- Adapter for connection of an integrated circuit package to a circuit board138US 5,168,432 AAdvanced Interconnections Corporation · 1992
- Semiconductor device125US 5,744,859 ATexas Instruments Incorporated · 1998
- Wire bonding method125US 7,621,436 B2Kabushiki Kaisha Shinkawa · 2009