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US 12,400,992 B2Granted
Semiconductor device with supporter against which bonding wire is disposed and method for preparing the same
AssigneeNanya Technology Corporation
InventorWu-Der Yang
Life of this patent
Estimating the term…
Abstract
A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a substrate, an electronic component, a bonding wire, and a supporter. The electronic component is disposed on the substrate. The bonding wire includes a first terminal connected to the electronic component and a second terminal connected to the substrate. The bonding wire is disposed against the supporter.
Claims19
A semiconductor device, comprising:
- a substrate;
- an electronic component disposed on a top surface of the substrate;
- a bonding wire comprising a first terminal connected to a top surface of the electronic component and a second terminal connected to the top surface of the substrate;
- and
- a supporter having a circular cross-sectional shape and defining a bottom point in contact with the top surface of the substrate, and positioning adjacent to a lateral surface of the electronic component, wherein the bonding wire is disposed against the supporter, wherein a diameter of the supporter is greater than a thickness of the electronic component, such that the supporter has a contacting surface at a highest point above the electronic component for the bonding wire contacting with the supporter in a tolerable tension manner so as to minimize a length of the bonding wire between the first terminal and the second terminal, wherein the contacting surface of the supporter is located out of the electronic component, the bonding wire is extended and biased against the contacting surface of the supporter in a tolerable tension manner, and a peak of the bonding wire is in contact with the contacting surface of the supporter away from the electronic component;
- wherein the bonding wire has a first portion extended from the first terminal to contact with the contacting surface of the supporter and a second portion extended from the contacting surface of the supporter to the second terminal.
3 more elements
A method of manufacturing a semiconductor device, comprising:
- providing a substrate;
- attaching an electronic component onto a top surface of the substrate;
- attaching a supporter to the substrate adjacent to the electronic component, wherein the supporter has a circular cross-sectional shape and defines a bottom point in contact with the top surface of the substrate, wherein the supporter is positioned adjacent to a lateral surface of the electronic component;
- and
- forming a bonding wire to have a first terminal connecting to a top surface of the electronic component and a second terminal connecting the top surface of the substrate,
- wherein the bonding wire is disposed against the supporter, wherein a diameter of the supporter is greater than a thickness of the electronic component, such that the supporter has a contacting surface at a highest point above the electronic component for the bonding wire contacting with the supporter, wherein the contacting surface of the supporter is located out of the electronic component, the bonding wire runs across the supporter, and a peak of the bonding wire is in contact with the contacting surface of the supporter away from the electronic component;
- wherein the bonding wire is extended and biased against the contacting surface of the supporter by:
- extending a first portion of the bonding wire from the first terminal to contact with the contacting surface of the supporter;
- and
- extending a second portion of the bonding wire from the contacting surface of the supporter to the second terminal, such that the bonding wire is extended in a tolerable tension manner to minimize a length of the bonding wire between the first terminal and the second terminal.
7 more elements
Dependencies are inferred from the claim text.