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US 12,417,965 B2Granted
Interconnect for IC package
AssigneeTexas Instruments Incorporated
InventorsRuby Ann Merto Camenforte, Floro Lopez Camenforte, Dolores Babaran Milo
Life of this patent
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Abstract
An integrated circuit (IC) package includes an interconnect comprising patches of unoxidized metal that are circumscribed by a region of roughened metal formed of oxidized metal. The IC package also includes a die mounted on the interconnect. The die is conductively coupled to at least a subset of the patches of unoxidized metal.
Claims23
An integrated circuit (IC) package comprising:
- an interconnect comprising patches of unoxidized metal that are circumscribed by a region of roughened metal formed of oxidized metal;
- pads arranged at a periphery of the interconnect, wherein the pads comprise a patch of the patches of unoxidized metal circumscribed by a portion of the region of roughened metal;
- and
- a die mounted on the interconnect, wherein the die is conductively coupled to at least a subset of the patches of unoxidized metal.
1 more element
An integrated circuit (IC) package comprising:
- pads adjacent to and at a periphery of a die, wherein the pads each comprise a patch of unoxidized metal circumscribed by a portion of a region of roughened metal;
- and
- a die mounted on the patches of unoxidized metal, there being no gap between a side surface of at least one of the patches of unoxidized metal and a side surface of the region of roughened metal formed of oxidized metal, wherein the die is conductively coupled to at least a subset of the patches of unoxidized metal.
An integrated circuit (IC) package comprising:
- a die attach pad formed of oxidized metal;
- pads spaced from a periphery of the die attach pad, at least some of the pads comprising a patch of unoxidized metal circumscribed by a region of oxidized metal;
- a die mounted on the die attach pad;
- and
- wherein the die is conductively coupled to at least a subset of the patches of the pads.
2 more elements
An integrated circuit (IC) package comprising:
- a die attach pad including a patch of unoxidized metal circumscribed by a region of roughened metal formed of oxidized metal;
- a die mounted on the patch of unoxidized metal;
- and
- wherein at least some of the pads include patches of unoxidized metal that are circumscribed by a region of roughened metal formed of oxidized metal, there being no gap between a side surface of at least one of the patches of unoxidized metal and a side surface of the region of roughened metal formed of oxidized metal, wherein the die is conductively coupled to at least a subset of the patches of unoxidized metal.
1 more element
Dependencies are inferred from the claim text.