H10W 72/583
Reinforcing structures
Official title: {Reinforcing structures}
H10W72/583 (Reinforcing structures) appears on 89 US grants and 104 published applications in this corpus.
Search patents in H10W- Granted patents
- 89
- Published applications
- 104
- Assignees
- 58
- Inventors
- 234
- Latest grant
- 26 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 4 |
| 2003 | 0 | 3 |
| 2004 | 1 | 0 |
| 2005 | 2 | 6 |
| 2006 | 4 | 6 |
| 2007 | 4 | 6 |
| 2008 | 2 | 3 |
| 2009 | 2 | 1 |
| 2010 | 1 | 6 |
| 2011 | 3 | 3 |
| 2012 | 6 | 4 |
| 2013 | 8 | 12 |
| 2014 | 3 | 4 |
| 2015 | 6 | 7 |
| 2016 | 7 | 5 |
| 2017 | 5 | 3 |
| 2018 | 4 | 5 |
| 2019 | 3 | 5 |
| 2020 | 4 | 3 |
| 2021 | 4 | 2 |
| 2022 | 1 | 4 |
| 2023 | 6 | 4 |
| 2024 | 2 | 3 |
| 2025 | 2 | 5 |
By publication year. Applications have been published since 2001.
Recent patents
- Semiconductor device with supporter against which bonding wire is disposed and method for preparing the same26 Aug 2025US 12,400,992 B2Nanya Technology Corporation
- Package-on-package assembly with wire bond vias28 Jan 2025US 12,211,821 B2Adeia Semiconductor Technologies LLC
- Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device17 Dec 2024US 12,170,262 B2STMicroelectronics (Grenoble 2) SAS
- Sensor package and manufacturing method thereof4 Jun 2024US 12,002,725 B2Amkor Technology Singapore Holding Pte.Ltd.
- Sensor package structure22 Aug 2023US 11,735,562 B2Tong Hsing Electronic Industries, Ltd.
- Semiconductor package22 May 2025US 2025/0167164 A1Samsung Electronics Co., Ltd.
- Package-on-package assembly with wire bond vias10 Apr 2025US 2025/0118705 A1Adeia Semiconductor Technologies LLC
- Semiconductor package and method of manufacturing the semiconductor package6 Mar 2025US 2025/0079390 A1Samsung Electronics Co., Ltd.
- Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device27 Feb 2025US 2025/0070081 A1STMicroelectronics (Grenoble 2) SAS
- Semiconductor package and method of manufacturing the semiconductor package2 Jan 2025US 2025/0006720 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Wire bonding method125US 7,621,436 B2Kabushiki Kaisha Shinkawa · 2009
- Package-on-package assembly with wire bond vias91US 8,404,520 B1Invensas Corporation · 2013
- Package-on-package assembly with wire bond vias82US 8,836,136 B2Invensas Corporation · 2014
- Package-on-package assembly with wire bond vias61US 9,105,483 B2Invensas Corporation · 2015
- Carrier-free semiconductor package and fabrication method thereof57US 7,314,820 B2Siliconware Precision Industries Co., Ltd. · 2008