Sensor package and manufacturing method thereof
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsJi Young Chung, Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong
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Abstract
A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise an interconnection structure, for example a bond wire, at least a portion of which extends into a dielectric layer utilized to mount a plate, and/or that comprise an interconnection structure that extends upward from the semiconductor die at a location that is laterally offset from the plate.
Claims31
A sensor device comprising:
- a substrate having a top substrate side, a bottom substrate side, and a lateral substrate side, the substrate comprising a conductive layer on the top substrate side;
- an electronic component comprising a top component side, a bottom component side coupled to the top substrate side, and a lateral component side, the electronic component comprising a sensing area on the top component side;
- a conductive interconnection structure electrically connecting the electronic component to the conductive layer of the substrate;
- an encapsulating material on the top substrate side and laterally surrounding the electronic component, the encapsulating material comprising a top encapsulating material side, a bottom encapsulating material side coupled to the top substrate side, and a lateral encapsulating material side;
- a dielectric layer (DL) coupled to the encapsulating material and comprising a top DL side, a bottom DL side, and a lateral DL side;
- and
- a plate positioned over the sensing area of the electronic component, the plate comprising a top plate side, a bottom plate side coupled to the top DL side, and a lateral plate side.
A sensor device comprising:
- a substrate comprising a top substrate side, a bottom substrate side, and a lateral substrate side, the substrate comprising a conductive layer on the top substrate side;
- an electronic component having a top component side, a bottom component side coupled to the top substrate side, and a lateral component side, the electronic component comprising a sensing area on the top component side;
- a conductive interconnection structure electrically connecting the electronic component to the conductive layer of the substrate;
- an encapsulating material on the top substrate side and laterally surrounding the electronic component, the encapsulating material comprising a top encapsulating material side, a bottom encapsulating material side coupled to the top substrate side, and a lateral encapsulating material side;
- and
- a plate positioned over the sensing area of the electronic component and over an entirety of the conductive interconnection structure, the plate comprising a top plate side, a bottom plate side, and a lateral plate side.
A method of manufacturing a sensor device, the method comprising:
- receiving a first structure comprising:
- a substrate having a top substrate side, a bottom substrate side, and a lateral substrate side, the substrate comprising a conductive layer on the top substrate side;
- an electronic component comprising a top component side, a bottom component side coupled to the top substrate side, and a lateral component side, the electronic component comprising a sensing area on the top component side;
- and
- a conductive interconnection structure electrically connecting the electronic component to the conductive layer of the substrate;
- positioning a plate over the sensing area of the electronic component, the plate comprising a top plate side, a bottom plate side, and a lateral plate side;
- and
- providing an encapsulating material on the top substrate side and laterally surrounding the electronic component, the encapsulating material comprising a top encapsulating material side, a bottom encapsulating material side coupled to the top substrate side, and a lateral encapsulating material side.
Dependencies are inferred from the claim text.