Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsDavid Auchere, Asma Hajji, Fabien Quercia, Jerome Lopez
Life of this patent
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Abstract
An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.
Claims10
A method, comprising the following steps:
- placing a first electrical connection wire between a first electrical connection pad of an electronic chip and a second electrical connection pad of a carrier substrate to which the electronic chip is mounted and forming first electrical junctions between ends of the first electrical connection wire and the first and second electrical connection pads;
- placing a second electrical connection wire between a third electrical connection pad of the electronic chip and a fourth electrical connection pad of the carrier substrate to which the electronic chip is mounted and forming second electrical junctions between ends of the second electrical connection wire and the third and fourth electrical connection pads;
- producing a dielectric coating made of a dielectric material, which completely covers the first electrical connection wire, but does not cover the second electrical connection wire, and completely covers the first electrical junctions, but does not cover the second electrical junctions, and further covers each of the first and second electrical connection pads without completely covering the third and fourth electrical connection pads;
- and
- producing a conductive shield made of an electrically conductive material which at least partially covers said dielectric coating at said first and second electrical connection pads and completely covers said dielectric coating at said first electrical junctions and further completely surrounds said dielectric coating at said first electrical connection wire;
- and
- wherein the electrically conductive material of said conductive shield is in direct contact with the second electrical connection wire.
Dependencies are inferred from the claim text.