Semiconductor package and method of manufacturing the semiconductor package

A semiconductor package, comprising:

• a package substrate having a first side portion extending in a first direction and a second side portion facing with the first side portion, the package substrate having a plurality of substrate pads spaced apart from each other along the first side portion and an upper insulation layer defining a recess that exposes the plurality of substrate pads;
• a dam structure extending on the upper insulation layer to surround the recess;
• a plurality of semiconductor chips stacked on an upper surface of the package substrate such that a first surface on which a plurality of chip pads are formed faces upward, the plurality of semiconductor chips being spaced apart from a side portion of the dam structure in a second direction perpendicular to the first direction;
• a plurality of bonding wires connecting the plurality of substrate pads to the plurality of chip pads of the plurality of semiconductor chips;
• and
• an underfill member filling an interior of the recess to cover an end portion of each of the plurality of bonding wires and each of the plurality of substrate pads.

A semiconductor package, comprising:

• a package substrate having a plurality of uppermost wires and an upper insulation layer on an upper surface of the package substrate, the upper insulation layer defining a recess exposing the plurality of uppermost wires, a plurality of substrate pads on the plurality of exposed uppermost wires, and a dam structure extending on the upper insulation layer to surround the recess;
• a plurality of semiconductor chips stacked on the upper surface of the package substrate by a plurality of adhesive films such that a first surface on which a plurality of chip pads are formed faces upward;
• a plurality of bonding wires connecting the plurality of substrate pads to the plurality of chip pads of the plurality of semiconductor chips;
• and
• an underfill member filling an interior of the recess to cover an end portion of each of the plurality of bonding wires and each of the plurality of substrate pads.