Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsDavid AUCHERE, Asma HAJJI, Fabien QUERCIA, Jerome LOPEZ
Life of this patent
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Abstract
An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the electronic chip is mounted. A dielectric layer surrounds at least the bonding wire. The dielectric layer may be a dielectric sheath or a hardened liquid dielectric material. A dielectric material may also cover at least a portion of the electrical chip and carrier substrate. A liquid electrically conductive material is deposited and hardened to form a local conductive shield surrounding the dielectric layer at the bonding wire.
Claims18
A method, comprising the following steps:
- mounting an electronic chip to a carrier substrate;
- connecting a bonding wire between an electrical connection pad of the electronic chip and an electrical connection pad of the carrier substrate;
- flowing a liquid dielectric material to coat said bonding wire and at least a portion of each of the electronic chip and the carrier substrate;
- hardening the liquid dielectric material to form a dielectric layer of substantially uniform thickness surrounding the bonding wire and on surfaces of said portion of each of the electronic chip and the carrier substrate;
- flowing a liquid electrically conductive material to coat the dielectric layer;
- and
- hardening the liquid electrically conductive material to form a conductive shield surrounding the dielectric layer on the bonding wire.
A method for making an electrical connection between an electronic chip and a carrier plate on which the electronic chip is mounted, comprising:
- installing at least one electrical connection wire between an exposed electrical connection pad of the electronic chip and an exposed electrical connection pad of the carrier plate and making electrical junctions between ends of the at least one electrical connection wire and the exposed electrical connection pads;
- producing a dielectric layer made of a dielectric material over an area of the electronic chip and the carrier plate, including the at least one electrical connection wire, the electrical junctions and the exposed electrical connection pads, by dispensing a determined amount of the dielectric material in a liquid state and hardening said dielectric material, wherein the dielectric layer produces a local dielectric coating surrounding the at least one electrical connection wire and covers the electrical junctions and the exposed electrical connection pads, and
- producing a local conductive shield made of an electrically conductive material which at least partially covers the local dielectric coating, wherein producing the local conductive shield comprises:
- locally dispensing a determined amount of an electrically conductive material in a liquid state, in the form of a calibrated drop which flows by capillary or wetting effect, through use of a controlled dispensing tool comprising a controlled dispensing syringe;
- and
- hardening said conductive material to produce the local conductive shield around the at least one electrical connection wire and the electrical junctions.
A method, comprising the following steps:
- placing an electrical connection wire between an exposed electrical connection pad of an electronic chip and an exposed electrical connection pad of a carrier substrate to which the electronic chip is mounted and forming electrical junctions between the ends of the electrical connection wire and the pads, the electrical connection wire being equipped with an insulating sheath made of a dielectric material which surrounds the electrical connection wire except at exposed ends of the electrical connection wire;
- producing a local dielectric coating made of a dielectric material, which at least partially covers at least one of the electrical connection pads, the electrical junction and exposed end of the electrical connection wire adjacent thereto and at least partially surrounds an end portion of the insulating sheath adjacent to the electrical junction;
- and
- producing a conductive shield made of an electrically conductive material which at least partially covers said dielectric coating and at least partially surrounds the insulating sheath.
Dependencies are inferred from the claim text.