Wire bonding method
AssigneeKabushiki Kaisha Shinkawa
InventorsTatsunari Mii, Toshihiko Toyama, Hiroaki Yoshino
Life of this patent
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Abstract
A wire bonding method including the steps of: descending a capillary 5 from above an external lead 1 to press a wire 10 to such an extent that the wire is not completely connected to the external lead 1, thus forming a thin part 16 in the wire; next ascending the capillary 5 and the thin part 16 to substantially the same height as a first bonding point A, then moving the capillary 5 in a direction away from the first bonding point A, thus making a linear wire portion 18 and then cutting the wire at the thin part 16; then connecting the end 19 (thin part) of the linear wire portion 18 and the wire tip end 20 at the lower end of the capillary 5 are connected to the external lead 1; and then separating the wire tip end 20 from the external lead 1.
Claims11
A wire bonding method for connecting a wire passing through a capillary between a first bonding point and a second bonding point with a use of said capillary, said method comprising, in the order stated, the steps of:
- opening a clamper and executing a first bonding of a ball preformed on a tip end of the wire of said capillary onto the first bonding point, to thereby form a pressure-bonded ball;
- moving said capillary vertically and horizontally while carrying out loop control;
- executing crush bonding the wire to the vicinity of the top of the pressure bonded ball on the first bonding point, to thereby form a wire bonding part;
- moving said capillary above a second bonding point for looping the crushed bonding part to the second bonding point;
- forming a thin part in the wire by descending said capillary from above the second bonding point and pressing the wire at a lower end of said capillary against the second bonding point;
- closing the clamper and ascending said capillary together with the thin part in the wire;
- forming a linear wire portion in the wire by pulling the first-bonded wire to move the capillary in a substantially horizontal direction and in a direction away from the first bonding point toward the second bonding point;
- breaking the linear wire portion at the thin part in the wire by moving further said capillary in a substantially horizontal direction and in the direction away from the first bonding point toward the second bonding point, to thereby form a wire tip end part at a tip end of said capillary;
- and
- executing a second bonding the wire tip end part of said capillary onto the second bonding point during pressing the thin part formed at the end of the linear wire portion, by use of said capillary, onto the second bonding point.
A wire bonding method for connecting a wire passing through a capillary between a first bonding point and a second bonding point with a use of said capillary, said method comprising, in the order stated, the steps of:
- opening a clamper and executing a first bonding of a ball preformed on a tip end of the wire of said capillary onto the first bonding point, to thereby form a pressure-bonded ball;
- moving said capillary vertically and horizontally while carrying out loop control;
- executing crush bonding the wire to the vicinity of the top of the pressure-bonded ball on the first bonding point, to thereby form a wire bonding part;
- moving said capillary above a second bonding point for looping the crushed wire bonding part to the second bonding point;
- forming a thin part in the wire by descending said capillary from above the second bonding point and pressing the wire at a lower end of said capillary against the second bonding point;
- closing the clamper and ascending said capillary together with the thin part in the wire,
- forming a linear wire portion in the wire by pulling the first-bonded wire to move said capillary in a substantially horizontal direction and in a direction away from the first bonding point toward the second bonding point;
- breaking the linear wire portion at the thin part in the wire by moving further said capillary in a substantially horizontal direction and in the direction away from the first bonding point toward the second bonding point, to thereby form a wire tip end part at a tip end of said capillary;
- pre-bonding a tip end of the wire at the lower end of said capillary to a point in a vicinity of the second bonding point by descending said capillary;
- opening the clamper and peeling the tip end of the wire by ascending said capillary from said point in a vicinity of the pre-bonded second bonding point;
- closing the clamper and forming a ball, used for second bonding, in a tail portion on the wire extending out from the lower end of said capillary, by a spark discharge made by an electric torch;
- opening the clamper and pressing the ball against the end of the linear wire portion;
- and
- executing a second bonding for bonding an end of the linear wire portion together with the ball onto the second bonding point and, in conjunction therewith, forming a pressure-bonded ball on the second bonding point.
Dependencies are inferred from the claim text.