Sensor package structure

A sensor package structure, comprising:

• a substrate including a chip bonding region and a plurality of soldering pads that are arranged outside of the chip bonding region;
• a sensor chip disposed on the chip bonding region, wherein a top surface of the sensor chip has a sensing region and a plurality of connecting pads that are arranged outside of the sensing region;
• a plurality of electrical connection members respectively and electrically connecting the connecting pads to the soldering pads, wherein each of the electrical connection members includes:
• a head solder disposed on the corresponding connecting pad;
• a wire having a first end and a second end that is opposite to the first end, wherein the first end of the wire extends from the head solder so as to connect the second end onto the corresponding soldering pad;
• and
• a tail solder fixed to the second end of the wire and the corresponding soldering pad;
• a supporting adhesive layer formed on the top surface of the sensor chip and surrounding an outer side of the sensing region, wherein for each of the electrical connection members, the head solder and a portion of the wire are embedded in the supporting adhesive layer, and the portion of the wire has a highest point that is spaced apart from the substrate by a maximum distance;
• and
• a light-permeable sheet disposed on the supporting adhesive layer, wherein the light-permeable sheet, the supporting adhesive layer, and the top surface of the sensor chip jointly define an enclosed space.

A sensor package structure, comprising:

• a substrate including a chip bonding region and a plurality of soldering pads that are arranged outside of the chip bonding region;
• a sensor chip disposed on the chip bonding region, wherein a top surface of the sensor chip has a sensing region and a plurality of connecting pads arranged outside of the sensing region;
• a plurality of electrical connection members respectively and electrically connecting the connecting pads to the soldering pads, wherein each of the electrical connection members includes:
• a head solder disposed on the corresponding connecting pad;
• a wire having a first end and a second end that is opposite to the first end, wherein the first end of the wire extends from the head solder so as to connect the second end onto the corresponding soldering pad, and the wire has a first bending portion arranged adjacent to the head solder and a second bending portion that is arranged between the first bending portion and the second end;
• and
• a tail solder fixed to the second end of the wire and the corresponding soldering pad;
• a supporting adhesive layer formed on the top surface of the sensor chip and surrounding an outer side of the sensing region, wherein for each of the electrical connection members, the head solder and a portion of the wire are embedded in the supporting adhesive layer;
• and
• a light-permeable sheet disposed on the supporting adhesive layer, wherein the light-permeable sheet, the supporting adhesive layer, and the top surface of the sensor chip jointly define an enclosed space.