Package-on-package assembly with wire bond vias

A microelectronic package comprising:

• a substrate having a first region and a second region, the substrate having a first surface and a second surface remote from the first surface;
• at least one microelectronic element overlying the first surface within the first region;
• first electrically conductive elements exposed at at least one of the first surface and the second surface of the substrate within the second region, at least some of the first conductive elements being electrically connected to the at least one microelectronic element;
• wire bonds having bases joined to respective ones of the first conductive elements, and end surfaces remote from the substrate and remote from the bases, each wire bond defining an edge surface extending between the base and the end surface thereof;
• a dielectric encapsulation layer extending from at least one of the first or second surfaces and filling spaces between the wire bonds such that the wire bonds are separated from one another by the encapsulation layer, the encapsulation layer overlying at least the second region of the substrate, wherein unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer,
• the encapsulation layer including a major surface and an alignment surface sloped with respect to the major surface, at least one unencapsulated portion of the wire bond being positioned on the major surface and the alignment surface being proximate to the major surface at a location adjacent to the unencapsulated portion such that the alignment surface is configured to guide an electrically conductive protrusion disposed above the alignment surface towards the unencapsulated portion of the wire bond.

A microelectronic package comprising:

• a substrate having a first region and a second region, the substrate having a first surface and a second surface remote from the first surface;
• at least one microelectronic element overlying the first surface within the first region;
• electrically conductive elements exposed at at least one of the first surface and the second surface of the substrate within the second region, at least some of the conductive elements being electrically connected to the at least one microelectronic element;
• ball bonds joined to at least some of the conductive elements;
• wire bonds defining edge surfaces and having bases bonded to the ball bonds atop the at least some conductive elements, the bases including first portions of the edge surfaces that extend over the conductive elements with respective second portions of the edge surfaces being at an angle between 25° and 90° relative to the first portions, the wire bonds further having ends remote from the substrate and remote from the bases;
• and
• a dielectric encapsulation layer extending from at least one of the first or second surfaces and covering portions of the wire bonds such that covered portions of the wire bonds are separated from one another by the encapsulation layer, the encapsulation layer overlying at least the second region of the substrate, wherein unencapsulated portions of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer, the unencapsulated portions including the ends.

A microelectronic package comprising:

• a substrate having a first region and a second region, the substrate having a first surface and a second surface remote from the first surface;
• at least one microelectronic element overlying the first surface within the first region;
• first electrically conductive elements exposed at at least one of the first surface and the second surface of the substrate within the second region, at least some of the first conductive elements being electrically connected to the at least one microelectronic element;
• wire bonds having bases joined to respective ones of the first conductive elements, and end surfaces remote from the substrate and remote from the bases, each wire bond defining an edge surface extending between the base and the end surface thereof;
• a dielectric encapsulation layer extending from the first surface and filling spaces between the wire bonds such that the wire bonds are separated from one another by the encapsulation layer, the encapsulation layer defining a first surface portion at a first height above the first surface in an area overlying the first region of the substrate and a second surface portion at a second height above the first surface in an area overlying the second region of the substrate, wherein the second height is less than the first height, and wherein unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.

A microelectronic package comprising:

• a substrate having a first region and a second region, the substrate having a first surface and a second surface remote from the first surface;
• at least one microelectronic element overlying the first surface within the first region;
• first electrically conductive elements exposed at at least one of the first surface and the second surface of the substrate within the second region, at least some of the first conductive elements being electrically connected to the at least one microelectronic element;
• wire bonds having ball-bond bases joined to respective ones of the first conductive elements, and end surfaces remote from the substrate and remote from the bases by a distance of less than three times a diameter of the base, each wire bond defining an edge surface extending between the base and the end surface thereof;
• a dielectric encapsulation layer extending from the first surface and filling spaces between the wire bonds such that the wire bonds are separated from one another by the encapsulation layer, wherein unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.

A microelectronic package comprising:

• a substrate having a first region and a second region, the substrate having a first surface and a second surface remote from the first surface;
• at least one microelectronic element overlying the first surface within the first region;
• first electrically conductive elements exposed at at least one of the first surface and the second surface of the substrate within the second region, at least some of the first conductive elements being electrically connected to the at least one microelectronic element;
• wire bonds having bases joined to at least some of the first conductive elements, and end surfaces remote from the substrate and remote from the bases, each wire bond defining an edge surface extending between the base and the end surface thereof, wherein at least two of the wire bonds are joined to an individual first conductive element of the plurality of first conductive elements;
• a dielectric encapsulation layer extending from at least one of the first or second surfaces and filling spaces between the wire bonds such that the wire bonds are separated from one another by the encapsulation layer, the encapsulation layer overlying at least the second region of the substrate, wherein unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.