H10W 72/585
Alignment aids
Official title: {Alignment aids, e.g. alignment marks}
H10W72/585 (Alignment aids) appears on 25 US grants and 32 published applications in this corpus.
Search patents in H10W- Granted patents
- 25
- Published applications
- 32
- Assignees
- 26
- Inventors
- 78
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 2 |
| 2010 | 0 | 0 |
| 2011 | 0 | 2 |
| 2012 | 2 | 1 |
| 2013 | 0 | 1 |
| 2014 | 2 | 1 |
| 2015 | 0 | 1 |
| 2016 | 2 | 2 |
| 2017 | 0 | 2 |
| 2018 | 2 | 1 |
| 2019 | 0 | 4 |
| 2020 | 1 | 2 |
| 2021 | 4 | 4 |
| 2022 | 4 | 3 |
| 2023 | 5 | 2 |
| 2024 | 0 | 1 |
| 2025 | 0 | 0 |
| 2026 | 2 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor apparatus and semiconductor apparatus manufacturing method1 Sep 2026US 12,727,524 B2Fuji Electric Co., Ltd.
- Method of manufacturing a semiconductor package and semiconductor package manufactured by the same6 Jan 2026US 12,519,082 B2SK hynix Inc.
- System for inserting a wire into a semiconductor chip21 Nov 2023US 11,822,309 B2Primo1D
- Semiconductor device having conductive wire with increased attachment angle and method31 Oct 2023US 11,804,447 B2Amkor Technology Singapore Holding Pte.Ltd.
- UV fixing glue for assembly3 Oct 2023US 11,778,753 B2Heraeus Deutschland GmbH & Co. KG
- Method of manufacturing a semiconductor package and semiconductor package manufactured by the same21 May 2026US 2026/0143722 A1SK hynix Inc.
- Method of manufacturing a semiconductor package and semiconductor package manufactured by the same1 Feb 2024US 2024/0038720 A1SK hynix Inc.
- Method for manufacturing a functional chip suitable for being assembled to wire elements27 Apr 2023US 2023/0130127 A1
- Semiconductor apparatus and semiconductor apparatus manufacturing method9 Mar 2023US 2023/0069967 A1Fuji Electric Co., Ltd.
- Semiconductor packages and manufacturing methods for the same10 Nov 2022US 2022/0359453 A1SK hynix Inc.
Most cited
By later US patents
- Semiconductor device having conductive wire with increased attachment angle and method7US 10,141,269 B2Amkor Technology, Inc. · 2018
- Semiconductor package structure2US 8,278,680 B2Forward Electronics Co., Ltd. · 2012
- Brace for bond wire2US 8,680,660 B1Freescale Semiconductor, Inc. · 2014
- Multi-chip package assembly with improved bond wire separation2US 9,431,364 B2Cypess Semiconductor Corporation · 2016
- Semiconductor device having conductive wire with increased attachment angle and method1US 10,943,871 B2Amkor Technology Singapore Holding Pte.Ltd. · 2021