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US 8,680,660 B1Granted
Brace for bond wire
AssigneeFreescale Semiconductor, Inc.
InventorsLai Cheng Law, Boh Kid Wong, Weng Foong Yap
Life of this patent
Estimating the term…
Abstract
In a semiconductor device having multiple tiers of bond wires extending in a first direction, dummy insulated bond wires extend in a second direction orthogonal to the first direction and between the wire tiers to support the wires in an upper tier to prevent them from sagging and contacting wires in a lower tier.
Claims20
A semiconductor device, comprising:
- a die flag;
- an integrated circuit die attached to a top surface of the die flag;
- a plurality of first leads spaced from a first side edge of the die flag;
- a first dummy lead spaced from a second side edge of the die flag;
- a second dummy lead spaced from a third side edge of the die flag opposite the second side edge;
- a plurality of first bond wires extending from a first set of bond pads on a top surface of the integrated circuit die to a first set of the plurality of first leads for electrically connecting the first set of bond pads to the first set of first leads;
- a plurality of second bond wires extending from a second set of bond pads on the top surface of the integrated circuit die to a second set of the plurality of first leads for electrically connecting the second set of bond pads to the second set of first leads;
- and
- at least one insulated bond wire extending from the first dummy lead to the second dummy lead and between the first and second pluralities of bond wires, wherein the at least one insulated bond wire prevents the plurality of second bond wires from sagging and contacting ones of the plurality of first bond wires.
6 more elements
A semiconductor device, comprising:
- a die flag;
- an integrated circuit die attached to a top surface of the die flag;
- a plurality of first leads spaced from a first side edge of the die flag;
- a first dummy lead spaced from a second side edge of the die flag;
- a second dummy lead spaced from a third side edge of the die flag opposite the second side edge;
- a plurality of first bond wires extending from a first set of bond pads on a top surface of the integrated circuit die to a first set of the plurality of first leads for electrically connecting the first set of bond pads to the first set of first leads;
- a plurality of second bond wires extending from a second set of bond pads on the top surface of the integrated circuit die to a second set of the plurality of first leads for electrically connecting the second set of bond pads to the second set of first leads,
- wherein the plurality of first bond wires have a different loop height than the plurality of second bond wires;
- and
- at least one insulated bond wire extending from the first dummy lead to the second dummy lead and between the first and second pluralities of bond wires, wherein the at least one insulated bond wire prevents the plurality of second bond wires from sagging and contacting ones of the plurality of first bond wires.
7 more elements
A semiconductor device, comprising:
- a die flag;
- an integrated circuit die attached to a top surface of the die flag;
- a plurality of first leads spaced from a first side edge of the die flag;
- a dummy lead spaced from a second side edge of the die flag that is adjacent to the first side edge of the die flag;
- a plurality of first bond wires extending from a first set of bond pads on a top surface of the die to a first set of the plurality of first leads for electrically connecting the first set of bond pads to the first set of first leads;
- a plurality of second bond wires extending from a second set of bond pads on the top surface of the integrated circuit die to a second set of the plurality of first leads for electrically connecting the second set of bond pads to the second set of first leads;
- and
- at least one insulated bond wire extending from a third bond pad on a top surface of the integrated circuit die and near an edge of the integrated circuit die to the dummy lead and between the first and second pluralities of bond wires, wherein the at least one insulated bond wire prevents the plurality of second bond wires from sagging and contacting ones of the plurality of first bond wires.
5 more elements
Dependencies are inferred from the claim text.