Semiconductor packages and manufacturing methods for the same

A semiconductor package comprising:

• a semiconductor chip including an edge pad portion and a bonding pad portion, wherein an edge of edge pad portion is aligned with an edge of the semiconductor chip;
• a package substrate on which the semiconductor chip is disposed, wherein the package substrate includes a bond finger;
• and
• a bonding wire connecting the bonding pad portion to the bond finger,
• wherein the semiconductor chip includes:
• a semiconductor substrate;
• and
• a polymer pattern formed on the semiconductor substrate to reveal edge portions of the semiconductor chip, a portion of the edge pad portion adjacent to an edge of the semiconductor chip, and the bonding pad portion, and
• wherein a portion of the bonding wire is physically supported by an edge of the polymer pattern such that the bonding wire is spaced apart from the edge pad portion, and
• wherein the edge of the polymer pattern is in direct contact with the revealed portions of the edge pad portions.