Semiconductor package structure
AssigneeForward Electronics Co., Ltd.
InventorsPei-Hsuan Lan, Che-Feng Huang
Life of this patent
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Abstract
A semiconductor package structure includes a bowl-like carrier, a semiconductor component, and electrode pins. The semiconductor component is disposed on the bowl-like carrier and is received in an accommodating recess of the bowl-like carrier. The electrode pins are electrically connected with the semiconductor component through wires. Channels are recessed along recess-walls of the accommodating recess and located between the semiconductor component and the electrode pins, where the wires pass through the channels. Therefore, the length of bonding wires can be reduced, and as well the cost of the wires, let alone the wires can be protected appropriately.
Claims5
A semiconductor package structure, comprising:
- a bowl-like carrier, defining an accommodating recess;
- a semiconductor component, being disposed on the bowl-like carrier and received in the accommodating recess;
- and
- electrode pins, being electrically connected with the semiconductor component through wires;
- characterized in that:
- channels are recessed along recess-walls of the accommodating recess and located between the semiconductor component and the electrode pins, where the wires pass through the channels;
- wherein the bowl-like carrier consists of a metallic loading portion and an insulating frame, where the semiconductor component is disposed on the metallic loading portion and the insulating frame defines the accommodating recess.
Dependencies are inferred from the claim text.