Semiconductor apparatus and semiconductor apparatus manufacturing method
AssigneeFuji Electric Co., Ltd.
InventorsNobuhiro HIGASHI, Daiki YOSHIDA, Yuma MURATA, Naoyuki KANAI
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Abstract
A semiconductor apparatus includes a semiconductor element, a control terminal electrically connected to a top electrode of the semiconductor element through a wiring member, and a case member in which at least a portion of the control terminal is embedded and which defines a space for housing the semiconductor element. The control terminal includes a pad to which the wiring member is connected. The case member includes a wiring member positioning part raised on the case member as a reference point for a positioning of the wiring member before a connection is made of the wiring member to the pad.
Claims11
A semiconductor apparatus, comprising:
- a semiconductor element having a top electrode;
- a control terminal including a pad electrically connected to the top electrode of the semiconductor element through a wiring member;
- and
- a case member in which at least a portion of the control terminal is embedded and which defines a space for housing the semiconductor element, wherein
- the case member includes a wiring member positioning part raised on the case member as a reference point for a positioning of the wiring member before a connection is made of the wiring member to the pad.
A method of manufacturing a semiconductor apparatus, comprising:
- preparing a semiconductor product that includes
- a semiconductor element with a top electrode,
- a control terminal, including a pad that is to be electrically connected to the top electrode of the semiconductor element through a wiring member, and
- a case member in which at least a portion of the control terminal is embedded and which defines a space for housing the semiconductor element, the case member including a wiring member positioning part raised on the case member as a reference point for positioning of the wiring member to be connected to the pad;
- producing a planar image of the area around the pad;
- and
- connecting the wiring member to the pad on a basis of relative coordinates between the positioning part and the pad in the planar image.
Dependencies are inferred from the claim text.