Semiconductor package with spacer strips

A semiconductor package, comprising:

• a substrate having opposite first and second surfaces;
• a first semiconductor die having a first surface with a plurality of terminal pads in a central portion thereof and an opposite second surface mounted on the first surface of the substrate;
• a first pair of spacer strips, each comprising a flat, elongated element of an insulative material having a first surface and an opposite second surface mounted on the first surface of the die adjacent to respective opposite edges thereof;
• a plurality of electrically conductive paths, each path connecting a terminal pad on the die to a terminal pad on the substrate and having an intermediate portion passing transversely across the first surface of one of the spacer strips;
• a means for enclosing the first semiconductor die, the first pair of spacer strips, the electrically conductive paths, and at least a portion of the first surface of the substrate within said semiconductor package;
• a second semiconductor die having opposite first and second surfaces;
• and,
• a second pair of spacer strips, each comprising a flat, elongated member of an insulative material having a first surface and an opposite second surface mounted on the second surface of the second die,
• the second die being mounted on the first die such that corresponding pairs of respective ones of the first surfaces of respective ones of the spacer strips in respective ones of the first and second pairs of the spacer strips are in opposed alignment with each other, and such that the intermediate portions of the conductive paths pass between a corresponding one of the pairs of opposing first surfaces of the spacer strips.

A semiconductor package comprising:

• a substrate;
• a semiconductor die coupled to the substrate, said semiconductor die including a first surface with an outer edge, and terminal pad at the first surface;
• an insulative spacer having a first surface, and an opposite second surface coupled to the first surface of the semiconductor die between the terminal pad and the outer edge;
• an electrically conductive path passing across the first surface of the spacer and electrically coupling the terminal pad to the substrate;
• and
• a means coupled to the substrate for protectively covering the semiconductor die, the spacer, the electrically conductive path, and at least a portion of the substrate,
• wherein the spacer includes a groove in the first surface that extends parallel to a direction of the electrically conductive path, and said electrically conductive path passes through said groove.

A semiconductor package comprising:

• a substrate;
• a semiconductor die coupled to the substrate, said semiconductor die including a first surface with an outer edge, and terminal pad at the first surface;
• an insulative spacer having a first surface, and an opposite second surface coupled to the first surface of the semiconductor die between the terminal pad and the outer edge;
• an electrically conductive path passing across the first surface of the spacer and electrically coupling the terminal pad to the substrate;
• and
• a means coupled to the substrate for protectively covering the semiconductor die, the spacer, the electrically conductive path, and at least a portion of the substrate,
• wherein the electrically conductive path is a single electrical conductor extending from the terminal pad to the substrate.

A semiconductor package comprising:

• a substrate;
• a semiconductor die coupled to the substrate, said semiconductor die including a first surface with an outer edge, and terminal pad at the first surface;
• an insulative spacer having a first surface, an electrically conductive region confined to the first surface of the spacer, and an opposite second surface coupled to the first surface of the semiconductor die between the terminal pad and the outer edge;
• and
• an electrically conductive path passing across the first surface of the spacer and electrically coupling the terminal pad to the substrate, wherein the electrically conductive path includes at least one electrical conductor bonded to the electrically conductive region.

A semiconductor package comprising:

• a substrate;
• a semiconductor die coupled to the substrate, said semiconductor die including a first surface with a perimeter, and terminal pad at the first surface;
• an insulative spacer having a first surface, an electrically conductive region confined to the first surface, and a second surface opposite the first surface and coupled to the first surface of the semiconductor die between the terminal pad and the perimeter;
• a first electrical conductor coupled between the terminal pad and the electrically conductive region, and a second electrical conductor coupled between the electrically conductive region and the substrate;
• and
• a means coupled to the substrate for protectively covering the semiconductor die, the spacer, the first and second electrical conductors, and at least a portion of the substrate.

A semiconductor package comprising:

• a substrate;
• a semiconductor die coupled to the substrate, said semiconductor die including a first surface with an outer edge, and terminal pad at the first surface;
• an electrically conductive path coupling the terminal pad to the substrate;
• and
• an insulative spacer having a first surface and an opposite second surface, wherein the first surface includes a groove extending parallel to a direction of the electrically conductive path, a portion of the electrically conductive path is within said groove, and the second surface of the insulative spacer is coupled to the first surface of the semiconductor die between the terminal pad and the outer edge.

A semiconductor package comprising:

• a substrate;
• a first semiconductor die coupled to the substrate, said first semiconductor die including a first surface with an outer edge, and terminal pad at the first surface;
• an insulative spacer having a first surface, and an opposite second surface coupled to the first surface of the first semiconductor die between the terminal pad and the outer edge;
• an electrically conductive path passing across the first surface of the spacer and electrically coupling the terminal pad to the substrate;
• and
• a second semiconductor die over the first die and coupled to the first surface of the insulative spacer over the electrically conductive semiconductor path, wherein the second semiconductor die is electrically coupled to the substrate,
• wherein the electrically conductive path is a single electrical conductor extending from the terminal pad of the first semiconductor die to the substrate.