Semiconductor device

A semiconductor device comprising:

• an IC chip containing a circuit and having a connection face provided with a plurality of bump electrodes coupled to the circuit;
• a flexible base film (i) having a device hole smaller than the IC chip's connection face and facing it at a predetermined gap distance and (ii) attached to a plurality of conducting leads having inner lead portions extending through the device hole and bonded to corresponding bump electrodes of the IC chip;
• a plurality of spacer projections, of a height equal to the gap distance, disposed around the device hole between the base film and the chip's connection face for maintaining the gap distance;
• and
• a sealant covering the inner lead portions, filling the device hole and the gap distance between the IC chip and flexible base film, and covering the IC chip's connection face.

A method of assembling a TCP semiconductor device, comprising the steps of:

• providing an IC chip containing a circuit and having a connection face provided with a plurality of bump electrodes coupled to the circuit;
• providing a flexible base film (i) having a device hole smaller than the IC chip's connection face and facing it at a predetermined sealing gap distance and (ii) attached to a plurality of conducting leads having unattached inner lead portions;
• providing a plurality of spacer projections, of a height equal to the sealing gap distance, disposed around the device hole between the base film and the chip's connection face for maintaining the gap distance;
• pushing the inner lead portions through the device hole and bonding them to corresponding bump electrodes of the IC chip.