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US 2025/0239496 A1Published application
Integrated circuit package
AssigneeSTMicroelectronics International N.V.
InventorYounes BOUTALEB
Life of this patent
Estimating the term…
Abstract
An integrated circuit package includes a substrate having a first surface and a second surface. An electronic integrated circuit chip has a first surface and a second surface, with the second surface mounted on the first surface of the substrate. A preformed glass cover is assembled on the first surface of the substrate and arranged to contain the electronic integrated circuit chip.
Claims22
An integrated circuit package, comprising:
- a substrate having a first surface and a second surface;
- an electronic integrated circuit (IC) chip having a first surface and a second surface, wherein the second surface is assembled on the first surface of the substrate;
- and
- a preformed glass cover assembled on the first surface of the substrate and arranged to contain the electronic IC chip.
1 more element
A method of assembling an integrated circuit package, comprising:
- providing a substrate having a first surface and a second surface;
- assembling an electronic integrated circuit (IC) chip, comprising a first surface and a second surface, on the substrate so that the second surface of the electronic IC chip is on the first surface of the substrate;
- and
- assembling a preformed glass cover on the first surface of the substrate, said preformed glass cover being arranged to contain the electronic IC chip.
1 more element
Dependencies are inferred from the claim text.