H10W 72/541
Dispositions of bond wires
Official title: {Dispositions of bond wires}
H10W72/541 (Dispositions of bond wires) appears on 15,389 US grants and 14,737 published applications in this corpus.
Search patents in H10W- Granted patents
- 15,389
- Published applications
- 14,737
- Assignees
- 2,249
- Inventors
- 20,583
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 19 | 0 |
| 1977 | 19 | 0 |
| 1978 | 13 | 0 |
| 1979 | 12 | 0 |
| 1980 | 13 | 0 |
| 1981 | 19 | 0 |
| 1982 | 15 | 0 |
| 1983 | 24 | 0 |
| 1984 | 15 | 0 |
| 1985 | 28 | 0 |
| 1986 | 21 | 0 |
| 1987 | 48 | 0 |
| 1988 | 28 | 0 |
| 1989 | 50 | 0 |
| 1990 | 75 | 0 |
| 1991 | 110 | 0 |
| 1992 | 129 | 0 |
| 1993 | 122 | 0 |
| 1994 | 158 | 0 |
| 1995 | 169 | 0 |
| 1996 | 177 | 0 |
| 1997 | 201 | 0 |
| 1998 | 284 | 0 |
| 1999 | 307 | 0 |
| 2000 | 348 | 0 |
| 2001 | 390 | 196 |
| 2002 | 409 | 584 |
| 2003 | 470 | 521 |
| 2004 | 487 | 565 |
| 2005 | 447 | 714 |
| 2006 | 464 | 636 |
| 2007 | 454 | 744 |
| 2008 | 386 | 734 |
| 2009 | 446 | 752 |
| 2010 | 595 | 744 |
| 2011 | 696 | 731 |
| 2012 | 673 | 641 |
| 2013 | 631 | 643 |
| 2014 | 679 | 674 |
| 2015 | 640 | 733 |
| 2016 | 689 | 659 |
| 2017 | 670 | 647 |
| 2018 | 596 | 596 |
| 2019 | 614 | 526 |
| 2020 | 510 | 603 |
| 2021 | 418 | 481 |
| 2022 | 443 | 536 |
| 2023 | 371 | 371 |
| 2024 | 368 | 329 |
| 2025 | 285 | 238 |
| 2026 | 154 | 139 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 72/547Dispositions of multiple bond wires7,242
- H10W 72/5449Not being orthogonal to a side surface of the chip5,769
- H10W 72/5445Being orthogonal to a side surface of the chip5,385
- H10W 72/5434The connected ends being on auxiliary connecting means on bond pads863
- H10W 72/5453Connecting between multiple bond pads on a chip650
- H10W 72/5438The bond wires having multiple connections on the same bond pad305
- H10W 72/543Of outermost layers of multilayered bond wires70
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Most cited
By later US patents
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