H10W 72/5438
The bond wires having multiple connections on the same bond pad
Official title: {the bond wires having multiple connections on the same bond pad}
H10W72/5438 (The bond wires having multiple connections on the same bond pad) appears on 305 US grants and 351 published applications in this corpus.
Search patents in H10W- Granted patents
- 305
- Published applications
- 351
- Assignees
- 111
- Inventors
- 610
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 5 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 5 |
| 2003 | 4 | 3 |
| 2004 | 7 | 14 |
| 2005 | 7 | 12 |
| 2006 | 12 | 13 |
| 2007 | 11 | 13 |
| 2008 | 9 | 19 |
| 2009 | 5 | 11 |
| 2010 | 16 | 18 |
| 2011 | 11 | 11 |
| 2012 | 15 | 16 |
| 2013 | 13 | 16 |
| 2014 | 16 | 7 |
| 2015 | 9 | 15 |
| 2016 | 12 | 13 |
| 2017 | 17 | 16 |
| 2018 | 13 | 12 |
| 2019 | 12 | 9 |
| 2020 | 9 | 22 |
| 2021 | 10 | 27 |
| 2022 | 18 | 29 |
| 2023 | 15 | 20 |
| 2024 | 31 | 13 |
| 2025 | 11 | 11 |
| 2026 | 8 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transistor device, semiconductor package and method of fabricating a transistor device18 Aug 2026US 12,713,671 B2Infineon Technologies Austria AG
- Security wire over stitch bond16 Jun 2026US 12,660,671 B2Texas Instruments Incorporated
- Package structure, semiconductor device, and formation method for package structure26 May 2026US 12,642,123 B2Rohm Co., Ltd.
- Semiconductor device and semiconductor device manufacturing method19 May 2026US 12,635,534 B2Fuji Electric Co., Ltd.
- Semiconductor device5 May 2026US 12,622,333 B2Rohm Co., Ltd.
- Semiconductor device20 Aug 2026US 2026/0248057 A1Rohm Co., Ltd.
- Packages with electrical fuses25 Jun 2026US 2026/0179869 A1
- Wire-bond structure for power packages to reduce rdson30 Apr 2026US 2026/0123506 A1Nexperia B. V.
- Universal Surface-Mount Semiconductor Package12 Mar 2026US 2026/0076242 A1Adventive International Ltd.
- Semiconductor package19 Feb 2026US 2026/0053015 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Semiconductor device including cladded base plate274US 8,963,321 B2Infineon Technologies AG · 2015
- Vertical power mosfet having thick metal layer to reduce distributed resistance258US 5,665,996 ASiliconix Incorporated · 1997
- Semiconductor package243US 6,040,626 AInternational Rectifier Corporation · 2000
- Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus125US 6,933,608 B2Kaijo Corporation · 2005
- Semiconductor stacked multi-package module having inverted second package and electrically shielded first package124US 6,933,598 B2ChipPAC, Inc. · 2005