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US 2026/0123506 A1Published application
Wire-bond structure for power packages to reduce rdson
AssigneeNexperia B.V.
InventorsChenchao Zhong, Randolph Estal Flauta, Haibo Fan
Life of this patent
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Abstract
A semiconductor device, a semiconductor package including such a semiconductor device and a method of manufacturing such a semiconductor package are presented. The semiconductor device includes a die and a leadframe. The semiconductor device further includes a wire-bond interconnect structure including one or more pairs of wires. Herein, a pair of wires includes two wires that are bonded together at one end at the die and that are bonded together on the other end at the leadframe.
Claims17
A semiconductor device comprising a die and a leadframe, and further comprising:
- a wire-bond interconnect structure comprising one or more pairs of wires,
- wherein one pair of wires comprises two wires that are bonded together at one end at the die and that are bonded together on the other end at the leadframe.
Dependencies are inferred from the claim text.